Dow Launches OPTIPLANE Advanced Chemical-Mechanical Polishing (CMP) Platform for Semiconductor Manufacturing

The global CMP consumables market continues to grow, driven in part by emerging applications in 3D logic, NAND flash memory, and packaging—each of which demands significantly enhanced planarization performance and minimal defect rates to meet the performance requirements of a wide array of advanced electronic devices. “Logic and memory chip companies that manufacture advanced semiconductor wafers are facing ever-growing challenges: they must adapt to constantly evolving demands, enhance performance, reduce costs, and simultaneously maximize production yields. As a result, CMP has become a critical factor in the semiconductor manufacturing process, and its use is steadily increasing,” says Dow Electronic Materials CMP Technologies.

The global CMP consumables market continues to grow, with part of the growth driven by new 3D logic. NAND Flash memory and packaging applications both demand significantly enhanced planarization performance and the lowest possible defect rates to meet the performance requirements of countless advanced electronic devices.

　　“Logic and memory chip companies that produce advanced semiconductor wafers are facing an increasing number of challenges: meeting constantly evolving demands, enhancing performance, reducing costs, and simultaneously boosting maximum throughput. As a result, CMP has become a critical factor in the semiconductor manufacturing process, and its use continues to grow.” Tao Shi “We have developed the OPTIPLANE™ slurry platform to meet our customers’ demand for CMP slurries—multifunctional, cost-effective, and capable of addressing ever-increasing requirements,” said Adam Manzonie, Global Director of Slurry Business at Electronic Materials CMP Technology Department.

　　Through advanced chemical formulations and optimized particle concentrations, OPTIPLANE CMP polishing slurries offer a variety of adjustable polishing rates and customizable selectivity options to meet customers’ unique, tailored specifications. The dilutable OPTIPLANE CMP polishing slurry platform not only delivers exceptional planarization efficiency and low defect rates but also boosts throughput and reduces cost of ownership (CoO).

　　 “As the leader in CMP technology, Dow has a deep understanding of the material interactions between CMP polishing pads and polishing slurries,” said Marty DeGroot, Global R&D Director of Dow Electronic Materials’ CMP Technology Division. “This insight enables us to leverage our R&D capabilities to develop polishing slurry formulations that not only match the performance of our polishing pads but also deliver unique performance benefits tailored to each customer’s specific needs.”

　　The first formulation to be launched is the OPTIPLANE™ 2118 CMP slurry—a next-generation interlayer dielectric (ILD) slurry that can also be used for various front-end-of-line (FEOL) polishing applications.

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