The seminar on the application of domestically produced materials in wafer-level packaging was successfully held at Huatian Technology’s Kunshan facility.

　　On October 9, 2016, the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials and Components Industry, together with Huatian Technology (Kunshan) Electronics Co., Ltd., jointly organized a “Seminar on the Application of Domestically Produced Materials in Wafer-Level Packaging” in Kunshan. The seminar was themed “Closely Integrating Process Development with Materials Technology to Promote Innovation in Wafer-Level Packaging Technologies and Materials and Accelerate the Localization of Materials.” It featured in-depth discussions on enhancing mutual understanding between Huatian Technology and various materials companies, fostering cooperation with domestic materials enterprises in the development of new products and processes for wafer-level packaging, achieving mutually beneficial outcomes, and promoting common development.

　　Dr. Yu Dazhuan, Deputy General Manager of Huatian Technology (Kunshan) Electronics Co., Ltd., introduced the group’s robust growth momentum, its technology roadmap and future technological deployment, as well as the key technologies and R&D progress related to the company’s core business. He also put forward specific requirements for domestically produced materials used in wafer-level packaging and expressed his hope that the company could collaborate as much as possible with domestic material suppliers in the development of new products and processes, thereby contributing to the localization and widespread adoption of wafer-level packaging materials. The participating companies actively presented their material products and research findings tailored to Huatian’s product processes, including CMP polishing slurries for wafer-level packaging, packaging photoresists, photoresist strippers, cleaning solutions, developer solutions, coupling agents, electroplating materials, materials for wet-process applications, photosensitive insulating materials, protective films resistant to crystal surfaces, and temporary bonding adhesives for wafers. Through exchanges between supply and demand sides, significant cooperation potential was identified in multiple material fields, and both sides demonstrated a strong willingness to collaborate.

　　Vice President Yu Daquan pointed out that Huatian Technology’s technical requirements differ significantly from the material requirements of integrated circuit manufacturing processes, and that system packaging processes are highly variable and evolving rapidly. He expressed the hope that material companies will conduct targeted, timely, rapid, and efficient product development and process innovation tailored to packaging technologies. Once a product meets the process requirements, demonstrates stable performance, and ensures reliable quality, it can be finalized and quickly advanced toward industrial-scale application. Secretary-General Shi Ying noted that Huatian Technology has provided participating companies with opportunities to engage in the company’s new projects and new processes. She encouraged material companies to fully seize this rare opportunity to accelerate their independent innovation capabilities, enhance their quality and quality assurance systems, take customer needs as their guiding principle, and offer solutions from the materials end to support Huatian Technology’s Kunshan company in developing new products and processes. By collaborating closely with customers, material companies can demonstrate their value and achieve synergistic development.

　　Attending this meeting were representatives from Huatian Technology (Kunshan) Electronics Co., Ltd., including Yu Daquan, Deputy General Manager; Hu Jinjin, Director of Operations; Huang Xiaohua, R&D Manager; Dr. Ma Li, Head of R&D; and Dr. Ma Shuying, Team Leader of the R&D Group, as well as over 20 representatives from the Materials and Components Alliance, including Secretary-General Shi Ying, the Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences; Shanghai Jiaotong University; Beijing Kehua Microelectronics Materials Co., Ltd.; Anji Microelectronics (Shanghai) Co., Ltd.; Shanghai Xinyang Semiconductor Materials Co., Ltd.; Suzhou Xinhao New Materials Technology Co., Ltd.; Kunshan Aisen Semiconductor Materials Co., Ltd.; Suzhou Ruihong Electronic Chemicals Co., Ltd.; Suzhou Jingrui Chemicals Co., Ltd.; Zhejiang Zhongna Jingwei Microelectronics Technology Co., Ltd.; and Shenzhen Huaxun Semiconductor Materials Co., Ltd.

　　HuaTian Technology Group is the second-largest domestic and sixth-largest global semiconductor packaging and testing company. Over the past 15 years, its business has experienced explosive growth. In 2016, its sales reached 6 billion yuan, and it is projected to reach 15 billion yuan by 2020. The group has R&D and production facilities in multiple locations, including Tianshui, Xi'an, Kunshan, Shanghai, and Phoenix Ridge in the United States. Among these, HuaTian Technology (Kunshan) Electronics Co., Ltd., established in 2008, is HuaTian Group’s most advanced R&D and production base for 8-inch and 12-inch packaging and testing.