Jiangfeng Electronics Joins Hands with American CeramTec to Usher in a New Chapter for China’s CMP Polishing Pad Industry.

On the morning of November 8, Ningbo Jiangfeng Electronic Materials Co., Ltd. and U.S.-based Cabot Microelectronics Corporation held a signing ceremony at the Shanghai New International Expo Center, officially announcing their collaboration on a project involving chemical-mechanical polishing (CMP) pads for semiconductor integrated circuits. Dr. Yao Lijun, Chairman of Jiangfeng Electronics, and Mr. David H. Li, President and CEO of Cabot USA, each signed the agreement on behalf of their respective companies. Shi Ying, Secretary-General of the Strategic Alliance for Technological Innovation in Integrated Circuit Materials and Components Industry, witnessed the signing ceremony. The manufacturing of ultra-large-scale integrated circuits is a high-tech endeavor.

On the morning of November 8, Ningbo Jiangfeng Electronic Materials Co., Ltd. and American Cabot Microelectronics Corporation held a signing ceremony at the Shanghai New International Expo Center, officially announcing their collaboration on a project involving chemical-mechanical polishing (CMP) pads for semiconductor integrated circuits.

Dr. Yao Lijun, Chairman of Jiangfeng Electronics, and Mr. David H. Li, President and CEO of U.S.-based JiaBo, each solemnly signed the agreement on behalf of their respective companies. Shi Ying, Secretary-General of the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials and Components Industry Witnessed This signing ceremony 。

The manufacturing of ultra-large-scale integrated circuits represents the commanding height of the high-tech industry and is also a strategic emerging industry that the Chinese government prioritizes for development. The establishment of the trillion-yuan fund for the development of the ultra-large-scale integrated circuit industry marks the beginning of China's chip manufacturing journey. As 2025 rapidly unfolds, China’s chip industry is beginning to play a pivotal role in the global semiconductor value chain. Over the past eight years, the nation’s Major Project 02 has achieved remarkable results in key materials and equipment, fostering close collaboration among numerous enterprises closely linked to the development of the integrated circuit industry. The recent cooperation agreement between Jiangfeng Electronics and U.S.-based JABCO is a prime example of this synergy.

Since its founding 11 years ago, Dr. Yao Lijun has led the entrepreneurial team at Jiangfeng Electronics, consistently focusing on the R&D and production of ultra-high-purity metal materials and sputtering targets for the manufacturing of ultra-large-scale integrated circuits. Currently, these products have been adopted in cutting-edge 16nm technologies by world-class semiconductor companies, filling a domestic technological gap in this field and breaking the long-standing monopoly held by multinational corporations from the U.S. and Japan.

Headquartered in Aurora, Illinois, USA, Applied Materials Inc. was listed on the NASDAQ in the United States in 2000. The company holds an undisputed leading position in the global CMP polishing and slurry sector and is also a rapidly growing supplier of CMP polishing pads.

The collaboration between Jiangfeng Electronics and U.S.-based Gabor is bound to inject fresh vitality into the independent and controllable development of China’s semiconductor industry, effectively accelerating the pace of local industrial upgrading, adjusting and optimizing the product structure of the industry chain, and opening a new chapter for mutual development!

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