Hotspot Focus
TSMC February 2017 Revenue Report
TSMC (TWSE: 2230, NYSE: TSM) today released its net revenue report for February 2017: Overall, the company’s total revenue in February 2017 amounted to NT$714.2 million, down 6.8% from January 2017 but up 19.9% from February 2016. In the first two months of 2017, the company’s total revenue reached NT$1.4804 billion, representing a 13.5% increase compared to the same period in 2016.
In January 2017, Dr. Lin Qinghuang, a specially appointed expert of the Materials and Components Alliance and a researcher at the Thomas J. Watson Research Center of IBM in the United States, was elected as a Fellow of the SPIE Society for 2017. On February 10, 2015, Dr. Lin Qinghuang was officially appointed as a specially appointed advisory expert of the Integrated Circuit Materials and Components Alliance. In 2016, he served as the Vice Chairman of the Advanced Microelectronics and Optoelectronics Materials Division at the 17th Asian Materials Conference, organized by the Alliance. At the same time, he also organized and personally taught the first training workshop on “Integrated Circuit Chip Manufacturing Processes and Integration Technologies,” which received an enthusiastic response from industry professionals.
On January 3, 2017—the first workday after the New Year’s Day holiday—Yang Shengshi, Secretary of the Lianyungang Municipal Party Committee, visited the Municipal Economic and Technological Development Zone to learn about the development of local industries. Jiangsu Huahai Chengke New Materials Co., Ltd., as one of the leading innovative enterprises in the new materials industry within the Lianyungang Municipal Economic and Technological Development Zone, was selected as one of the three companies to be inspected on-site. Accompanied by Han Jianglong, Chairman and General Manager of Jiangsu Huahai Chengke, Yang Shengshi and his delegation toured the company’s Jiangsu Provincial Engineering Technology Research Center for New Electronic Packaging Materials. They had a cordial conversation with Han Jianglong, the company’s head, and engaged in an in-depth exchange and discussion with relevant research personnel. Yang Shengshi wrote...
On December 21, 2016, the 718th Institute of CSSC Heavy Industry and Beijing University of Technology officially signed a cooperation agreement to jointly establish a Research and Development Center for Special Materials via Vapor Deposition. Du Gang, Deputy General Manager of CSSC Heavy Industry, and Luo Jiyuan, Director of the Department of Science & Technology and Informationization, as well as Zhao Changlu, Secretary of the Party Committee of Beijing University of Technology, and Yang Bin, Executive Vice President of the university, attended the signing ceremony. Li Junhua, Director of the 718th Institute, and Wang Lu, Dean of the Research Institute of Beijing University of Technology, signed the agreement. Representatives from relevant departments and units of both sides also participated in the ceremony. The holding of the signing ceremony marks the full launch of the R&D collaboration between the 718th Institute and Beijing University of Technology. According to the agreement,
2015 Silicon Substrate Materials Industry Data Statistics Report
This report is based on the requirements of the Chinese market and utilizes the latest data to analyze the domestic silicon-substrate materials industry from various perspectives, including industry size, product production capacity, R&D and industrial development investment, patent status, and workforce characteristics. The report was completed in November 2016. Table of Contents: 1. Overall Industry Size of Silicon-Substrate Materials in China; 2. Production Capacity of Key Products in the Silicon-Substrate Materials Industry; 3. R&D Investment in the Chinese Silicon-Substrate Materials Industry; 4. Industrial Development Investment in the Silicon-Substrate Materials Industry; 5. Patent Status in the Silicon Materials Industry; 6. Workforce Characteristics in the Silicon Materials Industry. Chart Index: Figure 1: Silicon-Substrate Materials, 2005–2016.
On the morning of November 8, Ningbo Jiangfeng Electronic Materials Co., Ltd. and U.S.-based Cabot Microelectronics Corporation held a signing ceremony at the Shanghai New International Expo Center, officially announcing their collaboration on a project involving chemical-mechanical polishing (CMP) pads for semiconductor integrated circuits. Dr. Yao Lijun, Chairman of Jiangfeng Electronics, and Mr. David H. Li, President and CEO of Cabot USA, each signed the agreement on behalf of their respective companies. Shi Ying, Secretary-General of the Strategic Alliance for Technological Innovation in Integrated Circuit Materials and Components Industry, witnessed the signing ceremony. The manufacturing of ultra-large-scale integrated circuits is a high-tech endeavor.
From October 20 to 24, 2016, the 17th Asian Materials Conference (IUMRS-ICA2016)—one of the most important series of conferences organized by the International Union of Materials Research Societies—was grandly held at the Qingdao International Convention & Exhibition Center in Qingdao, Shandong Province. The conference featured a total of 27 sub-conferences, with themes covering five major hot areas: energy and environmental materials, advanced structural materials, functional materials, biomaterials, and materials simulation, computation, and design. Hosted by the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials and Components Industry, and jointly supported by the Shanghai Institute of Microsystem and Information Technology of the Chinese Academy of Sciences and the Beijing Multi-Dimensional Electronic Materials Technology Development and Promotion Center, the event focused on "advanced...
On October 25, 2016, the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials and Components Industry (hereinafter referred to as the “Materials and Components Alliance”) successfully held a training course on “Integrated Circuit Chip Manufacturing Processes and Integration Technologies” in Qingdao. The conference featured a lecture by Dr. Lin Qinghuang, a member of the Expert Advisory Committee of the Materials and Components Alliance and a researcher at the IBM T.J. Watson Research Center in the United States. Dr. Lin has ten years of experience teaching this course in the U.S. The conference attracted more than 20 participants. In his opening remarks, Secretary-General Shi Ying emphasized the significance of this course and fully acknowledged everyone’s enthusiastic commitment to learning.
2016国际平坦化技术大会(ICPT 2016)在中国大陆首次成功举办
2016国际平坦化技术大会(InternationalConferenceonPlanarization/CMPTechnology，ICPT)于2016年10月17-19日在北京友谊宾馆圆满举行。ICPT是平坦化领域的规模最大、参与人数最多的国际盛会，每年一次，在美国、欧洲、日本、韩国、中国台湾、中国大陆等6个国家或地区轮流举办，今年是ICPT第一次在中国大陆举办。本次会议由中国平坦化技术联盟和
On October 9, 2016, the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials and Components Industry, together with HuaTian Technology (Kunshan) Electronics Co., Ltd., jointly organized a “Seminar on the Application of Domestically Produced Materials in Wafer-Level Packaging” in Kunshan. The seminar was themed “Closely Integrating Process Development with Material Technologies to Promote Innovation in Wafer-Level Packaging Technologies and Materials and Accelerate the Localization of Materials.” It featured in-depth discussions on enhancing mutual understanding between HuaTian Technology and various material suppliers, fostering cooperation with domestic material companies in the development of new products and processes for wafer-level packaging, achieving mutually beneficial outcomes, and promoting common development. HuaTian Technology (Kunshan) Electronics
1nm Transistor Is Born—Moore’s Law Will Remain Valid for the Long Term
According to a report released on the evening of October 7, Beijing time, a research team led by Ali Javey, a professor at the U.S. Lawrence Berkeley National Laboratory (hereinafter referred to as “Berkeley Lab”), recently developed the world’s smallest transistor using carbon nanotubes and a compound called molybdenum disulfide. A transistor consists of three terminals: the source, the drain, and the gate. Current flows from the source to the drain, and is controlled by the gate, which can be turned on and off depending on the voltage applied. Sujay De, a researcher at Berkeley Lab, ...
On September 2-3, 2016, the “SMIC Integrated Circuit Materials and Components Mass Application Supply-Demand Matchmaking Conference,” jointly organized by the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials and Components Industry (hereinafter referred to as the “Materials and Components Alliance”) and SMIC, was successfully held in Beijing. On the afternoon of the 2nd, the conference conducted matchmaking and exchange activities through six specialized subgroups. Each subgroup listened to briefings on the basic information and market expansion strategies of materials and components enterprises, as well as SMIC’s requirements for domestically produced materials and components, its verification processes, and its quality assessment system. The morning of the 3rd saw the holding of a session themed “Close Cooperation, Mutual Support, Coexistence and Win-Win, and Collaborative Development.”
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