Hotspot Focus
“Over the past 60 years, from vacuum-tube computers to today’s 7-nanometer devices, humanity has shrunk the area of microfabrication by a factor of one trillion. The innovation and advancement of front-end microfabrication equipment for semiconductor chips have been the key enablers behind this trillion-fold reduction.” This was a heartfelt remark made by Yin Zhiyao, Chairman and CEO of AMEC Semiconductor, at the 2018 China Semiconductor Materials and Components Innovation and Development Conference. As integrated-circuit components have evolved from “millimeter-scale processes” and “micrometer-scale processes” to “nanometer-scale processes,” the precision, uniformity, stability, and reliability of microfabrication have become critical factors determining the success rate of manufacturing microdevice products.
To accelerate the innovative development of local semiconductor materials and component enterprises, strengthen international cooperation, and build a local supply chain that is innovative, integrated, open, and mutually beneficial, the 2018 China Semiconductor Materials and Components Innovation Development Conference was held from October 29 to 31 in Beilun District, Ningbo City. The conference was co-organized by the Integrated Circuit Materials and Components Industry Technology Innovation Strategic Alliance, in collaboration with the Beilun District People's Government, the Ningbo Electronics Industry Association, and the U.S. Critical Materials Council. Liang Qun, member of the Standing Committee of the Ningbo Municipal Party Committee and Secretary of the Beilun District Party Committee, attended the opening ceremony and delivered a speech. The municipal science and technology...
From October 29 to 31, 2018, the China Semiconductor Materials and Components Innovation and Development Conference was held in Beilun. At the opening ceremony held on the 30th, Liang Qun, a member of the Standing Committee of the Municipal Party Committee and Secretary of the District Party Committee, attended and delivered a speech. Shen Endong, a member of the Standing Committee of the District Party Committee, Deputy Director of the Development Zone Management Committee, and Deputy Secretary of the Party Working Committee, also attended the event. On behalf of the Beilun District Committee of the Communist Party of China and the People's Government of Beilun District, Liang Qun extended a warm welcome to the guests who had come to Beilun to attend the China Semiconductor Materials and Components Innovation and Development Conference. He said that over the past 40 years of reform and opening-up, especially during the last 15 years, under the strong leadership of the provincial and municipal party committees, Beilun has consistently adhered to the overarching strategy of the “Eight-Eight Strategy” and demonstrated creativity.
On the afternoon of October 29, 2018, the ninth meeting of the second session of the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials and Components Industry was held in Ningbo. More than 110 representatives attended the meeting, including the Alliance’s Secretary-General, Vice-Chairman, Executive Directors, representatives from member units, and representatives from newly applying organizations seeking to join the Alliance. The meeting was chaired by Secretary-General Shi Ying. The meeting acknowledged the Alliance’s contributions in supporting the materials sector under Project 02, developing the technology roadmap for the integrated circuit materials industry, organizing industry matchmaking and academic exchange activities, conducting intellectual property research, collecting data and analyzing industry operations, promoting standardization within the Alliance, and participating in the compilation of the “Comprehensive Handbook of the Integrated Circuit Industry.”
Fan'erchen Semiconductor
Tianjin Huahai Qingke Mechanical and Electrical Technology Co., Ltd.
Tianjin Huahai Qingke Mechanical and Electrical Technology Co., Ltd.
Shanghai Xin'anna Electronic Technology Co., Ltd.
Shanghai Xin'anna Electronic Technology Co., Ltd.
Hua Jin Semiconductor Packaging Leading Technology R&D Center Co., Ltd.
Hua Jin Semiconductor Packaging Leading Technology R&D Center Co., Ltd.
Tianjin University of Technology
Tianjin University of Technology
Hebei University of Technology
Hebei University of Technology
Shanghai University
Southwest Jiaotong University
Huaqiao University
Dalian University of Technology
Dalian University of Technology
© 2025 Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance
Beijing Public Security Bureau Filing No. 11010102005379
Website construction:China Enterprise DynamicsBeijing