The 9th meeting of the 2nd Council of the Materials and Components Alliance was successfully held in Ningbo.

On the afternoon of October 29, 2018, the ninth meeting of the second session of the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials and Components Industry was held in Ningbo. More than 110 representatives attended the meeting, including the Alliance’s Secretary-General, Vice-Chairman, Executive Directors, representatives from member units, and representatives from newly applying organizations seeking to join the Alliance. The meeting was chaired by Secretary-General Shi Ying. The meeting acknowledged the Alliance’s contributions in supporting the materials sector under Project 02, developing the technology roadmap for the integrated circuit materials industry, organizing industry matchmaking and academic exchange activities, conducting intellectual property research, collecting data and analyzing industry operations, promoting standardization within the Alliance, and participating in the compilation of the “Comprehensive Handbook of the Integrated Circuit Industry.”

Council on-site

On the afternoon of October 29, 2018, the second ninth meeting of the Board of Directors of the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials and Components Industry was held in Ningbo. More than 110 people attended the meeting, including the Alliance’s Secretary-General, Vice-Chairman, Executive Directors, representatives from member units, and representatives from newly applying organizations seeking to join the Alliance. The meeting was chaired by Secretary-General Shi Ying.

The meeting affirmed the achievements and progress made by the Alliance in supporting the work of the Special Project 02’s materials sector, developing the technology roadmap for the integrated circuit materials industry, organizing industry matchmaking and academic exchange activities, conducting intellectual property research, collecting data and analyzing industry operations, promoting standardization within the Alliance’s member organizations, and participating in the compilation of the “Comprehensive Handbook of the Integrated Circuit Industry.” The meeting also deliberated and planned for the Alliance’s work in the second half of 2018. During the meeting, it was announced that the Zhongguancun Integrated Circuit Materials and Components Industry Technology Innovation Strategic Alliance has officially completed its registration. All member units of the Alliance unanimously approved, by a show of hands, the decision to directly transfer their membership relationships to this new Alliance. Additionally, the meeting reported that, as a social organization, the Alliance joined the China Storage Industry Alliance on October 26th. As a vice-chairman unit of the Alliance, the Alliance will play an active role in fostering deeper cooperation between materials and components enterprises and companies and research institutions in the storage manufacturing sector, thereby helping to build a robust supply chain for materials and components.

The meeting reviewed and voted to approve the membership applications of 12 companies, including Xiamen Jiguang Integrated Circuit Technology Co., Ltd., Alsi Refrigeration Engineering Technology (Beijing) Co., Ltd., Chengdu Komet Special Gases Co., Ltd., Suzhou Xinhao New Materials Technology Co., Ltd., Shanghai Dazhu Fuchuangde Technology Co., Ltd., Chongqing Tonghui Gas Co., Ltd., Henan Xinlianxin Cryogenic Energy Co., Ltd., Prici Technology (Beijing) Co., Ltd., Shengjisheng (Ningbo) Semiconductor Technology Co., Ltd., Shanghai Xinkemei Material Technology Co., Ltd., Wuxi Chuanda New Materials Co., Ltd., and Shanghai Weisong Industrial Automation Co., Ltd.

Finally, the participating delegates engaged in a lively discussion on the alliance’s development status, related matters, and work plans for the second half of 2018. They affirmed the alliance’s achievements over the past few years and suggested that the alliance help enterprises seize various development opportunities, strengthen connections with customers and suppliers, pursue differentiated development strategies, enhance cooperation among peers and their collective problem-solving capabilities, and foster mutual assistance and learning. Together, they aim to overcome more challenging bottlenecks in the materials and component sectors of the integrated circuit manufacturing industry and strive for a stronger position in the international market.

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