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NCAP and YOLE jointly organized a seminar on advanced packaging and system integration technologies.

2015.09.17

Dr. Yao Lijun, Vice Chairman of the Materials Alliance, was invited to attend the military parade ceremony.

2015.09.02

CMP Industry Technology Development Trends

2015.09.01

The 2nd Biannual Council Meeting of the Materials Alliance was held in Shanghai.

2015.08.31

The Materials Alliance promotes cooperation and exchange between materials companies and Suzhou Keshiny Photovoltaic.

2015.07.30

The domestic special gas industry development seminar was successfully held.

2015.07.30

Hebei Zhongci Electronic Technology Co., Ltd.

2015.07.30

Shennan Circuit Co., Ltd.

2015.07.30

Shenzhen Danbang Technology Co., Ltd.

2015.07.30

The Materials Alliance organized a team of experts to visit Guizhou University.

2015.07.30

Guizhou Weidun Jinglin Electronic Materials Co., Ltd.

2015.07.30

The national key science and technology project "300-mm Silicon Wafers for 40-28 nm Integrated Circuit Manufacturing" has been launched in Shanghai.

2015.07.29

Jiangfeng Electronics Listed Among the Top 100 Taxpayers in Yuyao City for the First Half of 2015

2015.07.24

Determination of the 450℃ Isothermal Section of the Ag-Cu-Sn Ternary System in the Ag-Cu-Rich Region

2015.07.23

Study on the Field Emission Performance of ZnO/Si-NPA

2015.07.23

Preparation and Performance Study of Supersaturated Sulfur-Doped Silicon Materials

2015.07.23

Study on the Structure, Magnetic Properties, and Transport Properties of Hexagonal MnNiGa Thin Films

2015.07.23

Obtaining High-Quality Silicon-Based Gallium Arsenide Materials

2015.07.23

Organic/Inorganic Alternating-Structure Thin-Film Process and Control for Encapsulation of Machine Parts

2015.07.23

The “Microelectronics and Optoelectronics” sub-venue of the 2015 China Materials Conference was successfully held.

2015.07.21

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