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The draft proposal for “Electronic-Grade Hydrogen Fluoride” is seeking public comments.

2025.09.05

Notice on Soliciting Comments on the Group Standard “Thick-Film Negative Photoresist for Advanced Packaging Copper Bump Process”

2025.08.27

Notice on the Renewal of the Alliance Standardization Technical Committee and Call for Members

2025.08.15

The 2025 Membership General Meeting and Expanded Board of Directors Meeting of the Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance was held in Shanghai.

2025.03.25

The “Intelligent Storage for the Future” Advanced Storage Collaborative Innovation Forum and High-Quality Development Exchange Meeting for the Advanced Storage Supply Chain were successfully held.

2024.11.19

The 2024 Integrated Circuit Key Materials Industry Cooperation (Dezhou) Conference was successfully held.

2024.10.16

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