The 2025 Membership General Meeting and Expanded Board of Directors Meeting of the Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance was held in Shanghai.

Shanghai in March carries both the crisp chill lingering from winter and the burgeoning warmth of new beginnings. On March 25, 2025, the 2025 Membership General Assembly and Expanded Board of Directors Meeting of the Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance were successfully held in Shanghai. The Alliance’s Chairman, Vice Chairmen, Directors, Supervisors, member units, and representatives from relevant organizations gathered together to jointly discuss the Alliance’s future development strategy. The meeting was chaired by rotating Chairman Wang Luping.

The members’ general meeting was scheduled to have 195 delegates, of whom 143 actually attended. Four letters of authorization were received. The number of attendees exceeded two-thirds of the total, thus meeting the requirements for the validity of the meeting and its voting procedures. At the meeting, the Alliance Secretariat reported on the 2024 work summary and the 2025 work plan of the Materials Alliance, comprehensively reviewing the Alliance’s achievements over the past year in areas such as industrial technological innovation and resource integration, and elaborating in detail on the new year’s work directions and key tasks.

The meeting reviewed a proposal to amend the Articles of Association of the Materials Alliance. The main contents of the amendment were introduced on-site, the new version of the Articles was presented, and a vote was held. The proposal was adopted unanimously. In addition, Wu Rufei from the Alliance Secretariat gave a report on the development of the smart supply chain service platform for integrated circuits, providing a detailed overview of the platform’s construction progress, functional modules, and future plans, thereby offering Alliance member organizations clear and comprehensive information about the supply chain service platform.

Concurrently with the conference, the Alliance also organized the Third Session of the Fourth Council (Expanded) Meeting. The meeting had a total of 56 registered delegates, with 51 in attendance. One letter of authorization was received. With more than two-thirds of the delegates present, the meeting and voting were deemed valid.

The meeting began with a vote on the newly admitted member companies. A total of 10 companies applied to join the alliance, namely: Jingxin Semiconductor (Huangshi) Co., Ltd., Guoke Tianji (Shandong) New Materials Co., Ltd., Anhui Yiyue Technology Co., Ltd., Tuoxin Technology (Quzhou) Co., Ltd., Guangdong Xulun Technology Co., Ltd., Jiangsu Jicui Photosensitive Electronic Materials Research Institute Co., Ltd., Suzhou Zhongxinlian Electronic Materials Co., Ltd., Heguang Photomask Technology (Anhui) Co., Ltd., Hunan Puzhao Information Materials Co., Ltd., and Jiangsu Kemet Technology Development Co., Ltd. At the meeting, each company introduced itself briefly. In the subsequent voting, all 10 companies were unanimously approved and successfully joined the alliance.

The meeting also reviewed a proposal to add new board member organizations and adjust the selection of board representatives. This time, five companies applied to become board member organizations, and three companies applied to replace their current board representatives. After voting, the proposal was unanimously approved.

Finally, the conference honored the outstanding information officers of 2024. A total of 13 individuals received this honor, recognizing their active contributions to the alliance in areas such as information dissemination and communication coordination.

The successful convening of the 2025 Membership General Assembly and (Expanded) Board of Directors Meeting of the Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance has laid a solid foundation for the alliance’s development in the coming year and will further promote technological innovation and collaborative development within the integrated circuit materials industry.

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