Notice on Soliciting Comments on the Group Standard “Thick-Film Negative Photoresist for Advanced Packaging Copper Bump Process”

To all member units of the alliance and industry experts from user organizations:

According to The “Integrated Circuit Materials Industry Technology Innovation Alliance Standards Committee” has completed the drafting of the following group standards and is now publicly soliciting broad comments.

Serial number	Project Approval Number	Standard Name
1	2024-5LX-ICMTIA	Thick-film negative photoresist for advanced packaging copper bump processes

Please each one. Relevant organizations and individuals Yu 2025 Year 9 Moon 27 Submit feedback soon. Please send your comments to the Alliance Standards Committee. There is no restriction on the format—simply ensure that your comments are clearly expressed. If no response is received by the deadline, it will be deemed that you have no comments.

Standards Committee Contact person Wang Dafang

Electricity words ：13811525241

Email: dafang_wang @icmtia.com

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