Yang Xinyuan

Chairman of Xi'an Yisiwei Materials Technology Co., Ltd.

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Personal Profile:

Yang Xinyuan, male, born in 1978, currently serves as the Chairman of Xi'an Yisiwei Materials Technology Co., Ltd. and is a member of the Standing Council of the Shaanxi Semiconductor Association.

Mr. Yang Xinyuan has over 20 years of experience in technology and management within the broader semiconductor industry. He has held senior management positions at multiple factories under BOE Technology Group. In 2018, Mr. Yang joined Eswe Technology Group, where he took full responsibility for the strategic planning, development, and operations of Eswe Group’s silicon materials business. The Eswe Silicon Industry Base project currently under implementation is a key project receiving strong support from both the National Development and Reform Commission and the Ministry of Industry and Information Technology. The first factory has already reached full production capacity of 500,000 wafers per month, with its shipment volume ranking among the highest in China; the second factory was completed and put into operation at the end of 2023.

As a seasoned entrepreneur in the semiconductor display and materials sectors, Mr. Yang Xinyuan has received numerous prestigious awards, including the First Prize for Technological Invention of Shaanxi Province, the “Leading Talent in Science and Technology Innovation for Middle-aged and Young Professionals” of Shaanxi Province, the “Qin Chuang Yuan Contribution Award” of Shaanxi Province, the “National-Level Leading Talent” of Xi'an City, and the “Leading Young Entrepreneur” of Xi'an City.

Speech Title:

Face the gaps head-on, forge ahead with determination, and comprehensively strengthen the foundation of the 12-inch silicon wafer industry.

Speech Abstract:

With substantial investment from both the national government and enterprises, China’s 12-inch silicon wafer industry has achieved leapfrog development, and the pace of domestic production has significantly accelerated. Currently, domestic manufacturers are already capable of supplying 12-inch silicon wafers required for various client-end products, essentially achieving comprehensive coverage of product types.

However, compared with the world’s top five silicon wafer manufacturers, domestic companies still have a certain gap in terms of technological level and market share. There is an urgent need for them to further enhance their competitiveness in order to meet the growing demands of the market.

In the future, domestic silicon wafer manufacturers must keep pace with global cutting-edge technological developments, increase R&D investment, break through core technology barriers, continuously optimize silicon wafer performance, and improve product yield to meet the increasingly stringent demands of downstream customers. At the same time, they should also strengthen cooperation with advanced upstream and downstream partners both domestically and internationally, build a well-rounded industrial ecosystem, and comprehensively solidify the foundation of China’s 12-inch silicon wafer industry.

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