Liu Qianfa
Director of the National Engineering Research Center for Electronic Circuit Base Materials, Guangdong Shengyi Technology Co., Ltd.
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Liu Qianfa, Director of the National Engineering Research Center for Electronic Circuit Substrate Materials and Senior Engineer.
Speech Title:
Advanced Packaging Materials for High-Power, High-Performance Computing
Speech Abstract:
As Moore’s Law gradually approaches its physical limits, advanced packaging technologies have become a crucial development direction for sustaining Moore’s Law. The rise of generative AI and large-scale models is further driving the evolution of semiconductor packaging materials toward system integration, higher data transmission rates, and enhanced thermal conductivity.
From the perspective of “electronic interconnection and packaging,” this article introduces the technological development trends for various application fields, such as AI servers and power semiconductors, as well as the requirements placed on semiconductor packaging materials. Using typical products as examples, it also illustrates the application scenarios and material solutions for these materials.
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