Product platform
Product platform
+
  • 16(1196).png

Ni and Alloy Targets for 200mm Wafer Processes

Ningbo Jiangfeng Electronic Materials Co., Ltd.

Category:

Target material

Product accessories:

Contact Us

Product Description

1. Purity ≥ 99.995%;

2. Grain size ≤ 100 μm;

3. Welding bond rate ≥ 95%;

4. Machining accuracy: 0.1 mm;

5. Sputtering surface roughness ≤ 0.4 μm;

Previous page

Ni and Alloy Targets for 300mm Silicon Wafer Processes

Co target material for 200mm silicon wafer processes

Next page

Previous page

Ni and Alloy Targets for 300mm Silicon Wafer Processes

Next page

Co target material for 200mm silicon wafer processes