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Co target material for 200mm silicon wafer processes

Ningbo Jiangfeng Electronic Materials Co., Ltd.

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Target material

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Product Description

1. Purity ≥ 99.999%;

2. Welding pass rate ≥ 97%;

3. Sputtering surface roughness ≤ 0.4 µm

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Ni and Alloy Targets for 200mm Wafer Processes

Co target material for 300mm silicon wafer processes

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Ni and Alloy Targets for 200mm Wafer Processes

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Co target material for 300mm silicon wafer processes