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Ni and Alloy Targets for 300mm Silicon Wafer Processes

Ningbo Jiangfeng Electronic Materials Co., Ltd.

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Target material

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Product Description

1. Purity ≥ 99.995%;

2. Grain size ≤ 100 µm;

3. Welding bond rate ≥ 95%;

4. Machining accuracy: 0.1 mm;

5. Sputtered surface roughness ≤ 0.4 μm;

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Cu and Alloy Targets for 200mm Wafer Processes

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Ni and Alloy Targets for 200mm Wafer Processes