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2020 China Semiconductor Materials Innovation and Development Conference

2020 China Semiconductor Materials Innovation and Development Conference

Release time:
2021/01/18 10:52
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In recent years, the development of information technologies such as 5G and artificial intelligence has been growing the new opportunities to the integrated circuit industry, while the worldwide epidemic outbreak of COVID-19 brings trouble to the global semiconductor manufacturing. The semiconductor materials industry is facing a challenge unparalleled. We need to consensus that the entire semiconductor industry should cooperate closely, and also coordinating the supply chain. Meanwhile the enterprises should enhance the ability to keep developing in uncertainty.

“2020 China Semiconductor Materials Innovation and Development Conference” will be held in Hefei, Anhui on September 14th –16th , 2020 theming with new tendency, new challenges and new breakthrough. Entrepreneurs, experts, and scholars who come from the semiconductor manufacturing, packaging, critical materials and equipment worldwide will gather together to discuss how to deepen the integration of the global semiconductor manufacturing, and how to strengthen the coordination of the supply chain, and how to enhance the comprehensive abilities of local materials companies to provide solid support for the sustainable development of the semiconductor manufacturing industry.

At the same time, a series of activities will be launched to enhance the exchange between upstream and downstream of the supplier chain (Supplier and Customer Connection Forum), and also build a bridge between enterprises and local government (Invited Connection Forum).

 

Host Organizations:

National Major Project Administration Office (02 Project)

Hefei Municipal People`s Government

China Semiconductor Industry Association

China Integrated Circuit Innovative Alliance

Organizers:

National Major Project Panel (02 Project)

Hefei Development and Reform Commission 

Hefei Investment Promotion Bureau 

Xinzhan High-tech Industrial Zone

The Integrated Circuit Materials Innovative Alliance

China Semiconductor Industry Association Support Industry Branch

Date:September 14th – 16th,2020

Location:SHERATON HEFEI XINZHAN HOTEL

                 (No.1666 Tongling North Road, Hefei, Anhui Province)

 

Agenda:

 

Date

Time

Content

September 14
(Monday)

10:00-19:00

Registration

13:30-16:00

ICMTIA 2020 General Assembly & Fourth Council of the Third Session (Closed)

18:00-20:00

Dinner

September 15
(Tuesday)

09:00-09:30

Opening Ceremony (Host: Dr. Lijun Yao)

09:30-09:45

Projects Signing Ceremony & Industrial Park Introduction(Host: Dr. Lijun Yao)
09:30 Key Projects Signing Ceremony
09:35 Investment Environment Promotion
09:40 Investment Environment Promotion & Materials Industrial Park Introduction of Xinzhan High-tech Industrial Zone

09:45-12:00

Keynote Speech(Host: Dr. Shumin Wang)
9:45  Tsinghua University- Professor  Dr.Shaojun Wei-【A Pragmatic View of the Current IC Industry】
10:10 ICwise- Chief Analyst  Vincent Gu-【Insights on the Development of China Semiconductor Industry in the New Situation】
10:35 Nexchip Semiconductor Corportation- President  HC Tsai-【Nexchip - Devoting to Material Sourcing Localization】
11:00 Yangtze Memory Technologies Co., Ltd. (YMTC)-COO  Weihua Cheng-【Fostering a Collaborative Ecosystem to Accelerate Industrial Prosperity】
11:25 JCET Group- Director of Board & Chief Executive Officer  Li Zheng-【Advanced Manufacturing Technologies Boost Semiconductor Materials Innovation】

12:00-13:30

Lunch

13:30-14:00

IC Material Award Ceremony(Host:Ying Shi)

14:00-17:00 

Invited Talks(Host: Dr.Chongying Xu)
1、14:00 DuPont - China General manager, Lithography Technology, Semiconductor Technology  Dr. Zhijian(George) Lu-【Innovation through Collaboration: Accelerating the Advancement of the IC Industry】
2、14:20 Shanghai Key Laboratory of Memory Nanofabrication Technology, Shanghai Institute of Microsystems, Chinese Academy of Sciences - Director  Dr.Zhitang Song -【Design and Development of High-Speed and Low-Power Phase Change Materials Based on Octahedral Motif and Three-Dimensional Confined Phase Transition Theory】
3、14:30 Kempur Microelectronics Inc. -CEO  Cindy Chen -【Opportunities and Challenges of PR Development under the New Situation】
4、14:50 Grikin Advanced Materials Co., Ltd.- Senior Technical Director  Dr.Junfeng Luo -【Advanced Target Preparation Along With the Development of Chip】
5、15:10 Hubei Sinophorus Electronic Materials Co., Ltd. - General Manager Assistant  Huidong Cui-【The Relationship between Phosphorus Chemical Industry Chain and
Electronic Chemicals and Comprehensive Utilization of Waste Tetramethylammonium Hydroxide.】
6、15:30 Jiangsu HHCK Advanced Materials Co., LTD. - R&D Manager  Wei Tan-【High Thermal Conductivity(≥3W) Epoxy Molding Compound】
7、15:50 Shengyi Technology (Suzhou) Co., LTD - Senior Engineer  Shenggao Xiao-【Development and Challenges of Copper Clad Liminate For IC Package Substrate in China】
8、16:10 Hangzhou Cobetter Filtration Equipment Co.,Ltd -CTO  Yoshiaki Yamada -【Metal Purifier Friendly with Photo Chemicals - Nylonpolar -】
9、16:30 TECHCET CA LLC- Sr. Market Analyst  Dr. Dan S.Tracy-【Material Markets Challenges and Opportunies】

18:00-20:00

Reception

September 16
(Wednesday)

8:30-10:00

Government and Enterprise Connection Forum(Invited)
Nexchip Forum

8:30-12:00

Supplier and Customer Connection Forum(Closed)

12:00-13:30

Lunch

13:30-17:30

Supplier and Customer Connection Forum(Closed)

18:00-20:00

Dinner

 

Partnership: