We are now faced with the challenges brought by the domestic and overseas supply chain as well as series of new developing opportunities in the starter of The 14th Five-Year Plan. In order to gather the entire industrial chain of domestic integrated circuit manufacturing and the talents in various fields to strengthen the communication among the integrated circuit material industry chain, the Integrated Circuit Materials Innovation Alliance (hereinafter referred to as the "ICMtia") along with China Semiconductor Industry Association Support Industry Branch will jointly hold the “24th China Integrated Circuit Manufacturing Annual Conference and Supply Chain Innovation and Development Conference” with China Semiconductor Industry Association IC Design Branch, China Integrated Circuit Packaging and Testing Innovation Alliance, China Integrated Circuit Equipment Innovation Alliance, China Integrated Circuit Components Innovation Alliance, and China Integrated Circuit Detecting and Testing Innovation Alliance for the first time. The theme of the conference will be “New Starter，New Challenges, New Vitality , and New Energy”, during which ICMtia will hold the "2021 China Semiconductor Materials Innovation and Development Conference".
On the 2021 ICM, concentration will be focused on the current development trend of the global semiconductor materials industry and the development status of China`s materials industry, and industry experts and corporate executives will be invited to jointly discuss the emerging focus of breakthroughs in the material industry, the new needs of corporate innovation and development, and the new synergy between industries and regions. Thus, all the people who are involved in the domestic integrated circuit materials industry could be stimulated to meet new challenges and overcome new problems with a more active, confident, open and inclusive attitude. At the same time, the Special Supplier and Customer Connection Forum, Workshop on Advance Materials and other activities will be hosted during 2021 ICM.
Host Organizations：
National Office for the Implementation and Management of Major Scientific and Technological Projects for Very Large-scale
Integrated Circuit Manufacturing Equipment and Complete Processes
China Semiconductor Industry Association
Integrated Circuit Materials Industry Technology Innovation Alliance
Department of Industry and Information Technology of Guangdong Province
Guangdong Provincial Development and Reform Commission
Department of Science and Technology of Guangdong Province
Guangzhou Municipal Industry and Information Technology Bureau
Huangpu District/Guangzhou Development District People`s Government
Guangzhou Development District Administration Office
Organizers：
Integrated Circuit Materials Industry Technology Innovation Alliance
China Semiconductor Industry Association Support Industry Branch
China Semiconductor Industry Association IC Design Branch
China Integrated Circuit Packaging and Testing Innovation Alliance
China Integrated Circuit Equipment Innovation Alliance
China Integrated Circuit Components Innovation Alliance
China Integrated Circuit Detecting and Testing Innovation Alliance
Guangdong Integrated Circuit Industry Association
Guangdong-Hong Kong-Macao Greater Bay Area Semiconductor Industry Alliance
Date: October 25- October 27,2021
Venue: Guangzhou NARADA Hotel(No.129 Wenjian Road, Huangpu District, Guanzgou, Guangdong Province, P.R China.)
2021 China Semiconductor Materials Innovation and Development Conference
Nov.1
9:00-12:00 Registration
13:30-15:00 General Assembly& Alliance Council Meeting (Closed)
15:30-17:30 Supplier and Customer Connection Forum for ICMtia Member (Closed)
Nov.2
9:00-12:00 CICD Summit Forum
12:00-14:00 Lunch
14:00-17:00 CICD Summit Forum
13:30-17:30 Supplier and Customer Connection Forum for ICMtia Member (Closed)
18:00 Dinner Party
Nov.3 2021 China Semiconductor Materials Innovation and Development Conference
9:00-9:30 IC Award Ceremony
Host: Ying Shi, Executive Vice Chairman &Secretary General，ICMtia
9:30-12:00 Keynote Speech
Host: Dr. Shuming Wang, Chairman and General Manager, Anji Microelectronics Technology（Shanghai）Co., Ltd.
Dr. Lijun Yao, Chairman and Chief Technology Officer, Konfoong Materials International Co., Ltd.
9:30- 9:50 Advanced Packaging and Its Material Requirements
Speaker：Dr. Key. Chung, Advanced Package CTO, TongFu Microelectronics Co.,Ltd
9:50-10:10 Reinventing Electronics in the Era of Disruptive Convergence
Speaker：Rick Chen, General Manager, Merck China
10:10-10:30 Current Status and Development Expectation of Electronic Gas Used in Integrated Circuits
Speaker: Dr. Junhua Li, Chairman, PERIC Special Gases Co.,Ltd
10:30-10:50 Art of CMP, Scientific Principles of Materials Engineering at the Nano Scale Interface
Speaker: Dr. Yuchun Wang, Vice President, Anji Microelectronics Technology（Shanghai）Co., Ltd.
10:50-11:10 ArF Photoresist Product Development and Industrialization Progress
Speaker: Dr. Zhibiao Mao, Vice President, Ningbo Nata Opto-Electronic Materials Co.,Ltd
11:10-11:30 Semiconductor Materials Outlook, Challenges, and Emerging Opportunities
Speaker: Dr. Dan P. Tracy, Sr. Director and Sr. Market Analyst, TECHCET
11:30-11:50 The Status and Development Tendency of China IC Manufacturing Material Industry
Host: Ying Shi, Executive Vice Chairman & Secretary General, ICMtia
12:00-13:00 Lunch
13:15-18:00 ICMtia Advanced Materials Workshop (Closed)
Golden Partnership：
Brown Partnership：
