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2019 China Semiconductor Materials Innovation and Development Conference

2019 China Semiconductor Materials Innovation and Development Conference

Release time:
2021/01/18 10:50
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In 2019, while the growth rate of the global semiconductor industry is slowing down, domestic industry is also facing severe challenges, especially in the field of semiconductor materials. In order to sustain the current rapid growth, strengthening collebations between domestic and international companies and improving supplier chain technical capability, are becoming critical tasks. The “2019 China Semiconductor Materials Innovation and Development Conference” will be held in Ningbo, China on September 10 –September 11, 2019.

During the China Semiconductor Materials Innovation and Development Conference, Chinese and international entrepreneurs, experts and scholars working in the field of semiconductor industry, including wafer processing, packaging assembly and testing, etc., will gather together to discuss how to deepen domestic and international cooperation, accelerate technology development, and promote ecological development. A series of activities will be launched to enhance the exchange between upstream and downstream of the supplier chain (Supplier and Customer Connection Forum), and also build a bridge between enterprises and local government (Key Topic Discussion Forum).

 

Host Organizations:

Ningbo Municipal People`s Government

China Semiconductor Industry Association

China Integrated Circuit Industry Technology Innovation Alliance

Organizers:

Integrated Circuit Materials Industry Technology Innovation Alliance

China Semiconductor Industry Association Support Industry Branch

Co-organizers:

Beilun District People`s Government of Ningbo Municipality

Ningbo Electronic Industry Association

Date:September 10 – September 11, 2019

Location:Radisson Beilun Ningbo  No.1288 Baoshan Road, Beilun District, Ningbo

Agenda:

 

Date

Time

Content

September 9
(Monday)

10:00-20:00

Registration

18:00-20:00

Buffet Dinner

September 10
(Tuesday)

09:00-09:30

Opening Ceremony(Host:Ingrid Shi)

09:30-10:20

Keynote Speeches (Host:Shumin Wang)
1、9:30-10:00 TSMC Nanjing Company Limited-Deputy Director of Lithography Engineering Department Jet Chen-【The High Quality Material VS Advanced Technology】
2、10:00-10:30 SiEn (Qingdao) Integrated Circuits Co., Ltd. – Chairman Richard R. Chang Ph.D-【Historical Opportunities of China Semiconductor Ecosystem】

10:30-10:45

Break

10:45-12:00

3、10:45-11:15 SiEngine-CEO Kai Wang Ph.D-【The Automotive Development and Semiconductor Materials Evolution】
4、1:15-11:45 Piotech Co., Ltd.- President & CEO  Brian Lu Ph.D-【Development Synergy and Technology Breakthrough in Semiconductor Equipment and Materials】

12:00-13:30

Buffet Lunch

13:30-15:30 

Invited Reports (Host:Chongying Xu)
1、13:30-13:55 TECHCET CA LLC- Sr. Market Analyst  Dan S.Tracy Ph.D-【Material Challenges and Opportunities for Emerging Device Applications】
2、13:55-14:20 Zing Semi - EVP Lu Fei Ph.D-【300mm wafer in China’s IC ecosystem】
3、14:20-14:45 GrandiT Co., Ltd. - General Manager Philip Chen -【Insights into Industrial Development of Fluorinated Electronic Chemical Materials in China】
4、14:45-15:10 Hitachi Chemical - Technical Director of Packaging Solution Center Toshihisa Nonaka  Ph.D-【Materials can drive advanced packaging】
5、15:10-15:35 AKM Electronics Technology (Suzhou) Company Ltd - Technical Director for 5G Projects Victor Qi Ph.D-【The Millimeter Wave Module Packaging Based On Flexible Substrates】
6、15:35-16:00 Hangzhou Cobetter Filtration Equipment Co., Ltd - Senior Technical Partner of Cobetter 200L Semiconductor Drum Project  Khaled Atta-【Opportunities in the Packaging of Semiconductor and Electronic Chemicals】

16:30-19:15

Reception Dinner

19:30-20:40

Stage Show

September 11
(Wednesday)

8:30-12:00

ICMtia Supplier and Customer Connection Forum【Invited】

9:00-11:30

Key Topic Discussion Forum【Invited】

12:00-13:30

Buffet Lunch

14:00-16:30

IC Talents Salon【Invited】

14:00-17:30

ICMtia Enlarged Council Meeting【Closed】
CSIA Support Industry Branch General Assembly【Closed】

18:00-20:00

Buffet Dinner

 

 

Partnership: