On August 28, the second session of the 2nd council meeting of the Integrated Circuit Materials & Components Industry Technology Innovative Alliance Shanghai (hereinafter referred to as the "Alliance") was successfully held in Shanghai. The council meeting summarized the work of the Materials Alliance in the first half of 2015 and deployed the work for the second half of the year. The meeting was presided over by Secretary General Shi Ying, and Academician Wang Xi, Chairman of the Council, attended the meeting and delivered a speech. More than 80 representatives from the member units of the Alliance attended the meeting.
The remarkable achievements achieved by the Material Alliance in the first half of 2015 in supporting government and industry work such as National Science and Technology 02 Major Project, promoting mass production application, organizing industry and academic exchange activities, conducting regional cooperation, and completing the data collection and analysis of industry operations in 2014, as well as the construction of the Material Alliance itself were fully affirmed in the council meeting. In the second half of the year, the Materials Alliance will focus on promoting the mass production application of domestically produced materials, the implementation of industrial technology planning programs in key areas, the preparation of Chinese IC Materials Conference, and the exchanges between Chinese and Japanese electronic materials enterprises. The application for joining in the Alliance from 6 units including Linggas (Tianjin) Limited, Wuxi Ruijie Xinsheng Electronic Technology Co., Ltd., Tianjin Weipu Taike Technology Development Co., Ltd., Shanghai High Hope Industrial Co., Ltd., Hangzhou Tongyi Gas Research Institute and Kunshan Jingke Microelectronics Material Co., Ltd., was reviewed and approved in the meeting.
Academician Wang Xi, Chairman of the Council, conveyed the contents related to the materials sector in the 13th Five-Year Plan. He also suggested that material companies should maintain close interaction with National Science and Technology 02 Major Project and the Material Alliance, seize the opportunity of the central and local funds to lean toward the integrated circuit industry, and make breakthroughs in promoting the integration of integrated circuit materials industry and building large enterprises in key areas. He also hoped that the Materials Alliance can play an important supporting role in the planning and layout of the national material strategy in addition to the National Science and Technology 02 Major Project.