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Annual Meeting of China Semiconductor Materials and Components Development 2017 was held in Beilun, Ningbo.

Annual Meeting of China Semiconductor Materials and Components Development 2017 was held in Beilun, Ningbo.

Source:
2017/10/27
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From October 22 to 23, 2017, the "Annual Meeting of China Semiconductor Materials and Components Development 2017" (hereinafter referred to as the "Annual Meeting") was grandly held in Beilun District, Ningbo City. Supported by the National Science and Technology 02 Major Project group and the integrated circuit industry technology innovation strategic alliance, the meeting was sponsored by the Integrated Circuit Materials & components Industry Technology Innovative Alliance and undertook by China Semiconductor Industry Association Supporting Industry Branch, and People's Government of Beilun District, Ningbo City. Ma Junru, leader of supervision and evaluation expert group of National Science and Technology Major Specialized Electronic and Information Sector and former Director of the State Administration of Foreign Experts, Qiu Gang, Deputy Director of National Science and Technology 02 Major Project Special Implementation Management Office and Deputy Inspector of the Major Special Project Office of the Ministry of Science and Technology, Wang Zhengpin, Academician of National Academy of Engineering and foreign Academician of the Chinese Academy of Engineering, Chen Xian, Vice Chairman of China Semiconductor Industry Association, Shi Ying, National Science and Technology 02 Major Project Group Expert and Secretary General of the Alliance, Yang Shining, General Manager of Wuhan Yangtze Memory Technologies Co., Ltd., Zhang Xin, General Manager of SMIC North, George Alajajian, Vice President of US Applied Materials, Mao Hongfang, Party Secretary of Beilun District committee, Ningbo City, and Hu Kui, Chief of Beilun District, Ningbo City attended the event. Dr. Yao Lijun, Chairman of Ningbo Jiangfeng Electronics and Dr. Wang Shumin, Chairman of Anji Microelectronics, presided over the meeting. The opening ceremony of the "Integrated Circuit Materials and Components Alliance (Ningbo) Industry Promotion Center and the release ceremony of the Integrated Circuit Materials and Components Industry Guidance Fund, for Integrated Circuit Materials and Components Industry - "Shengxin Fund" were held in the meeting.

  

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In order to accelerate the innovation and development of local semiconductor manufacturing materials and components companies, and strengthen international cooperation to create a local supply chain of innovation, openness, cooperation and win-win, nearly 300 people from the well-known semiconductor materials and components companies, integrated circuits manufacturing and packaging enterprises, high levels of high-end equipment manufacturing companies and related experts and scholars at home and abroad gathered together to heatedly discuss and exchange opinions on the development trend of China's semiconductor manufacturing materials and components supply chain, future technology and market demand, international cooperation and localization integration path, promotion of technical innovations and preferential policies for industrial development.

Deputy Director Qiu Gang said in his speech that materials and components are in the upstream of integrated circuit manufacturing, and always in the upstream of innovation. “Why the water is so clear, it is because of the source of flowing water.” Its innovative creation will bring more surprises to integrated circuits, and will also provide the strongest support for the reflection of human intelligence in the future. In the past few years, under the long-term and sustained support of national major special projects and the guidance of the development plan of the integrated circuit industry, the integrated circuit materials and components industry has made great progress and outstanding achievements, but there is still a big gap with the world advanced level. It is hoped that with the vigorous promotion of Integrated Circuit Materials and Components Alliance, the industry will actively face the future, increase high-start international cooperation, and play high-level innovation capabilities to accelerate the improvement of China's core competitiveness, and promote the development of China's materials and components industry.

  

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Vice Chairman Chen Xian pointed out that in recent years, promoted by a series of policies, the development plan of the integrated circuit industry and the establishment of the national fund by the state, China's IC materials industry has achieved good results and ushered in unprecedented good opportunity. The integrated circuit market in China and the industry in China will also achieve rapid development. Relevant ministries and commissions of the state are encouraging the implementation of the effectiveness evaluation of the development policy of the integrated circuit industry, aiming to promote the implementation of industry policies to the large-scale production line as soon as possible in the supported key enterprises, key products, and supported materials and components. It is hoped that materials and components companies will strengthen independent innovation and international cooperation to continuously promote the industrialization of results.

  

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Hu Kui, Chief of Beilun District, Ningbo City, introduced the overall situation of Beilun District in Ningbo City, the establishment of Xingang Town and the development of integrated circuit materials and components industry, emphasizing the high-end positioning and precision services of the integrated circuit industry during the development, and hoping to build the integrated circuit industry into a new pillar industry in Beilun District.

  

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Zhang Xin, General Manager of SMIC North, introduced the current situation of China's integrated circuit manufacturing industry, the localization path of materials and equipment, and the difficulties faced. He proposed specific measures and requirements for industrial chain integration, and hoped that the industry would unite as one, and struggle to meet the new era of China's integrated circuit industry development, so as to achieve "Chip Goes Through the World."

  

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George Alajajian, Vice President of US Applied Materials, made a keynote speech on promoting the growth of China's semiconductor industry and developing supply chain, which mainly introduced the requirements of applied materials companies, semiconductors and display market and semiconductor/display industry chain, emphasizing the importance of big data research.

  

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Liang Zhizhong, Senior Director of Jiangsu Changjiang Electronics Technology Co., Ltd., introduced the system-level packaging technology and market status and development trend, analyzed the opportunities and challenges faced by packaging materials, and hoped that material companies could seize the system-level packaging technology and industrial development opportunities to realize the long-term development of packaging materials industry.

  

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John West, President of VLSI Research, analyzed the product structure of global integrated circuit equipment subsystem and key component, global industry distribution and development trend, the case about the breakthrough development of Korean equipment subsystem and key components driven by Korean integrated circuit IC industry, as well as the development opportunities of China's integrated circuit manufacturing industry, and predicted that China's key components and subsystems will be expected to enter a period of rapid growth.

  

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Shi Ying, National Science and Technology 02 Major Project group expert and Secretary General of the Alliance, demonstrated the rapid development and steady growth of the semiconductor manufacturing materials market through a large amount of detailed data in the report, analyzed the new trends of industrial development, and advocated the domestic material industry to focus on creating the industrial chain ecosystem of “close cooperation, mutual support, symbiosis and win-win and collaborative development”, and actively seek international cooperation and create a dynamic development model of “innovation, cooperation, openness and win-win” based on independent innovation. The material enterprises should not only be the suppliers of integrated circuit manufacturing, but also should have the ability to become manufacturing partners.

  

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Director Ma Junru concluded that under the guidance and promotion of major national special projects, the integrated circuit industry has achieved great development. In the future, it should be application-oriented and bold innovation should be made in terms of technology, market, international and domestic cooperation, especially paying attention to the big role of cross-border innovation and big data in improving the quality of materials and components, and drawing on the experience of the development of integrated circuit equipment, materials and components industry in the United States and South Korea to promote the development of China's integrated circuit materials and components industry.

  

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In the afternoon, Bian Yijun, Deputy General Manager of Ningbo Konfoong Materials International Co., Ltd, Wang Shaobo, Deputy Director of the 718th institute of CSIC, Wang Yuchun, General Manager of Anji Microelectronics, Chen Tian’an, General Manager of Yantai Deppon, Zhao Lixing, General Manager of Beijing Jingyi Automation, Liu Xianbing, Chairman of the Board of Directors of Suzhou Kematek, Zhang Jiping, Intellectual Property Rights Minister of Hubei Dinglong, and Huang Picheng, Vice President of Pall Corporation of the United States made keynote speeches entitled "Cooperation and Win-Win, Deep Development – New Progress of Ultra High Purity Metals, Sputtering Target Materials and Components in China", “Development Status and Trends of Electronic Gas in China", "The Past and Future of Microelectronic Materials - Focus on CMP Consumables and Cleaning Fluids", "Industry Opportunities and Development of Semiconductor Electronic Packaging Materials in China", "New Requirements of Modern IC Equipment for Auxiliary Equipment”, “Research on Patent Layout of CMP Polishing Pads”, and “Control of Defects in 14-Nano Technology” respectively.

  

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Afterwards, the participating experts and scholars also held round-table discussions on two topics, including: 1. How to conduct close cooperate in terms of chip manufacturing, advanced packaging, key equipment and materials and components to achieve a win-win situation; 2. Advice on technology and industrial policies that promote international cooperation, enhance innovation capabilities, and accelerate the development of local supply chains.

While the industry authorities study the future development plan, evaluate and formulate the preferential policies for the development of the industry, gathering the wisdom of Chinese and foreign experts and entrepreneurs to convene this event will definitely help plan a blueprint for the future development of integrated circuit materials and components industry.

On October 22, the Alliance also held the inaugural meeting of the Standards Committee of the Alliance, which mainly discussed three issues, namely, the discussion, revision and adoption of the draft system document of the Standards Committee, including: “Procedure Documents for Formulation of Standards”, “Organizational Structure Documents of Standardization Work”, “System Documents of Intellectual Property Management”, “Standardization Management Documents”, discussion, revision and adoption of the draft standardization work plan (or standard system guide) of the Standards Committee, and discussion on the approval of project approval proposals of 22 Alliance group standard projects collected by the member units.

  

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