Cao Liqiang

Deputy Director of the Institute of Microelectronics, Chinese Academy of Sciences

Category:

Alliance Expert Advisory Committee

Committee member

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Product Description

Graduated from the University of Science and Technology of China in July 1997 with a degree in Applied Chemistry. In June 2005, he graduated from Chalmers University of Technology in Sweden, earning a Ph.D. in Microelectronics and Nanoelectronics. He currently serves as the Deputy Director, Researcher, and Doctoral Supervisor at the Institute of Microelectronics (IMECAS) of the Chinese Academy of Sciences. Since 2000, he has been engaged in research on system-level packaging and three-dimensional integration. His representative work includes: developing key integrated technologies centered on TSV-based interconnects; pioneering domestically the fabrication of 300mm wafer TSV transition boards and via-last TSV processes, reaching internationally advanced levels; developing advanced common key technologies for packaging such as BOT, TCB-NCP, FC+WB, and fan-out packaging; successfully achieving the fabrication of Cu/Ni/SnAg microbumps on 12-inch wafers; and establishing a platform for the verification and promotion of domestically produced equipment and materials. Currently, he holds the positions of Vice Chairman of the National Strategic Alliance for Technological Innovation in the Integrated Circuit Packaging and Testing Industry Chain and Executive Deputy Secretary-General; is a member of the Overall Expert Group for the National Key R&D Program “Manufacturing Equipment and Complete Processes for Ultra-Large-Scale Integrated Circuits”; serves as a reviewer for the National Natural Science Foundation and the Zhejiang Provincial Natural Science Foundation; and is a doctoral supervisor at Fudan University, Central South University, and the University of Chinese Academy of Sciences. He is also a reviewer for journals including Journal of Material Science, Journal of Electronic Packaging, Journal of Soldering and Surface Mount Technology, IEEE CMPT Trans., Microelectronic Reliability, and Science China. He has delivered invited keynote speeches multiple times at academic conferences on integrated circuit packaging organized by the Institute of Electrical and Electronics Engineers (IEEE), and has been repeatedly invited to serve as Co-Chair and Chair of Technical Committees at these conferences.

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