Invited Speaker: Prof. Chingping Wong
The Chinese University of Hong Kong, China
Category:
2016
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Prof. Wong was elected as a member of the U.S. National Academy of Engineering in 2000 and became a Foreign Academician of the Chinese Academy of Engineering in 2013. He is also a Distinguished Expert with the China Integrated Circuit Materials Industry Technological Innovation Strategic Alliance. Currently, Prof. Wong holds the position of Regents’ Professor and Charles Smithgall Institute Endowed Chair at the School of Materials Science and Engineering, Georgia Institute of Technology (GT), and serves as Dean and Professor of Electronic Engineering at the Faculty of Engineering, The Chinese University of Hong Kong (CUHK). Additionally, he leads the Guangdong Innovation Team for Advanced Electronic Packaging Materials (SIAT). Prof. Wong has an extensive publication record, having authored over 1,000 technical papers and achieved groundbreaking research results. He holds more than 50 U.S. patents. Considered an industry legend, Prof. Wong has made significant contributions to the semiconductor packaging industry by pioneering new materials that have fundamentally transformed semiconductor packaging technology. Over the years, Prof. Wong has received numerous international honors, including being elected as an AT&T Bell Laboratories Fellow in 1992, receiving the IEEE CPMT Society Outstanding Sustained Technical Contributions Award in 1995, becoming a member of the U.S. National Academy of Engineering in 2000, earning the IEEE Third Millennium Medal in 2000, receiving the IEEE EAB Education Award in 2001, being awarded the IEEE CPMT Society Exceptional Technical Contributions Award in 2002, receiving the Georgia Tech Class of 1934 Distinguished Professor Award in 2004, being named holder of the Charles Smithgall Chair (one of GT’s two Institute Chairs) in 2005, receiving the GT Outstanding PhD Thesis Advisor Award, winning the IEEE Components, Packaging and Manufacturing Technology Field Award in 2006, being honored with Sigma Xi’s Monie Ferst Award in 2007, receiving the Society of Manufacturing Engineers’ Total Excellence in Electronic Manufacturing Award in 2008, and earning the IEEE CPMT David Feldman Award in 2009 and the Dresden Barkhausen Award in 2012. Most recently, Prof. Wong was awarded the Pennsylvania State University Outstanding Science Alumni Award.
Topic: Electronic Packaging Technology and Materials
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