Branch Committee Member Shangguan Dongkai
CEO of HuaJin Semiconductor Packaging Leading Technology R&D Center Co., Ltd.
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2016
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Male, PhD, Researcher, CEO of HuaJin Semiconductor Packaging Leading Technology R&D Center Co., Ltd., Researcher at the Institute of Microelectronics, Chinese Academy of Sciences, Executive Advisor to the Director of the Institute, and Director of the System Packaging Technology Laboratory. He is also the Project Leader for the “High-Density Three-Dimensional System Integration Technology Development and Industrialization” project under the National Key Science and Technology Major Project “02 Special Project.” Dr. Shangguan graduated from Tsinghua University in China with a degree in Mechanical Engineering, earned a PhD in Materials Science from the University of Oxford in the UK, and an MBA from San Jose State University in the US. He has also conducted postdoctoral teaching and research at the University of Cambridge in the UK and the University of Alabama in the US. He serves as a visiting professor at several universities (including as a “Changjiang Scholar Distinguished Professor”). Dr. Shangguan has published two monographs and over 200 papers and technical articles, holds more than 20 U.S. and international patents, and has delivered numerous scientific and technological reports and keynote speeches.
Shangguan Dongkai worked in the Electronics Division of Ford Motor Company for 10 years, holding various technical and managerial positions. After 2001, he spent over 10 years at Flextronics International, serving as Global Vice President of Technology at the company’s headquarters and Chair of the Engineering Leadership Committee.
Dr. Shangguan is an IEEE Fellow, serves as a Director and Distinguished Lecturer at IEEE CPMT, and is an Associate Editor of the IEEE CPMT journal. He has also served as Chair of the iNEMI “Assembly Technology Roadmap” and as a Director at IPC.
Dr. Shangguan has received numerous awards, including the IEEE CPMT “Award for Outstanding and Sustained Technical Contributions,” the IPC “President’s Award,” the SME (Society of Manufacturing Engineers) “Comprehensive Excellence Award in Electronic Manufacturing,” the SEM “Leadership Award,” the Soldertec “Lead-Free Soldering Award,” and the San Jose State University College of Business “Distinguished Alumni Award.”
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