Three-dimensional stereoscopic imaging X-ray microscope
Category:
Joint Analysis, Testing, and Technology Cooperation Service Platform
Testing instrument
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Product Description
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Instrument and Equipment Information |
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Instrument Name |
Chinese: Three-dimensional stereoscopic imaging X-ray microscope |
Instrument model |
Y.CT Precision S |
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3D Imaging X-Ray Microscope |
Place of origin and manufacturer |
Germany/YXLON |
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Affiliated Unit |
The Fifth Research Institute of the Ministry of Industry and Information Technology (China SaiBao Laboratory) |
Acquisition time |
2019 |
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Placement location |
No. 78, West Zhu Village Avenue, Zhu Village Subdistrict, Zengcheng District, Guangzhou City, Guangdong Province |
Instrument Status |
Normal |
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Device application range / Instrument measurement range (tolerance) |
Application scope: Non-destructive three-dimensional imaging of internal microstructures in electronic components, as well as failure analysis inside packages and chips. It can non-destructively detect defects such as bond wire breaks, internal voids, foreign particles, shifted or bridged solder joints, cold solder joints, porosity, solder joint voids, and cracks within components. Main parameters: Maximum 3D spatial resolution ≤ 0.9 μm. |
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Whether it is regularly calibrated by a third-party agency |
Yes |
CNAS certification obtained. |
Yes |
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