Substrate placement machine
Category:
Joint Analysis, Testing, and Technology Cooperation Service Platform
Process equipment
Other process equipment
Product accessories:
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Product Description
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Instrument and Equipment Information |
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Instrument Name |
PCB pick-and-place machine |
Instrument model |
Palomar3800 |
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English: None yet |
Place of origin and manufacturer |
United States/Palomar |
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Affiliated Unit |
Hua Jin Semiconductor Packaging Leading Technology R&D Center Co., Ltd. |
Acquisition time |
December 2016 |
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Placement location |
No. 3, Beitucheng West Road, Chaoyang District, Beijing |
Instrument Status |
Normal |
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Device application range / Instrument measurement range (tolerance) |
Flip-chip: Flip-chip placement accuracy: ±5 µm (3σ theoretical value); Vacuum platform: 400 mm × 250 mm; Pick-up capability for chip edge lengths: 10 mil to 100 mil; Mark recognition capability: cross, triangle, with side length of 150 µm and tolerance of ±20 µm. In-situ reflow: Maximum chip size: 50 mm × 50 mm; Maximum heating rate: 20°C/s; Maximum cooling rate: 8°C/s; Maximum temperature: 450°C. Supported solder types: gold-tin and tin-silver alloys. Nitrogen atmosphere; chamber cover opening size: 17 mm × 17 mm. Surface mount technology: Minimum component size that can be picked up: 01005; Pick-up speed: 20–200 mil/s; Mounting accuracy and drop-speed control: 20–200 mil/s; Drop acceleration: 2 mil/s²; Lift-off acceleration: 10–20 mil/s². Supports simultaneous pick-up from five component tape reels with automatic feeding; Pick-up spacing: 2 mm and 4 mm standard tape formats; Can handle wafer chips up to 8 inches in size. |
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Whether it is regularly calibrated by a third-party agency |
No |
CNAS certification obtained. |
No |
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