Laser direct-writing exposure machine
Category:
Joint Analysis, Testing, and Technology Cooperation Service Platform
Process equipment
Other process equipment
Product accessories:
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Product Description
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Instrument and Equipment Information |
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Instrument Name |
Chinese: Laser Direct Writing Exposure Machine |
Instrument model |
Paragon-Ultra200 |
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English: None yet |
Place of origin and manufacturer |
Israel/OBBA |
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Affiliated Unit |
Hua Jin Semiconductor Packaging Leading Technology R&D Center Co., Ltd. |
Acquisition time |
October 2010 |
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Placement location |
No. 3, Beitucheng West Road, Chaoyang District, Beijing |
Instrument Status |
Normal |
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Device application range / Instrument measurement range (tolerance) |
For exposure. Minimum dimensions: L/S = 8/12 μm; Wavelength: 355 nm; Frequency: 8 W; Resolution: 1 μm; Edge roughness: ±1 μm; Alignment accuracy: ±5 μm; Interlayer alignment accuracy: 10 μm; Exposure energy: 10–2200 mJ; Substrate thickness: 0.05–3 mm; Maximum pattern size: 508 × 609 mm; Maximum substrate size: 558 × 660 mm. |
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Whether it is regularly calibrated by a third-party agency |
No |
CNAS certification obtained. |
No |
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