Beijing Kehua Microelectronics Materials Co., Ltd.
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Product Description
| Product Category | Secondary Category | Product Name | Image introduction | Manufacturer | Product Features |
| Photoresist and Polyimide | UV broad-spectrum photoresist | BN301 Series |
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Beijing Kehua Microelectronics Materials Co., Ltd. | The BN301 series UV negative photoresist is a type of negative photoresist that uses broad-spectrum ultraviolet exposure. It is primarily used in the fabrication of semiconductor discrete devices and other microdevices. The viscosity of this product can be adjusted within the range of 20–60 mPa·s, and it covers a photoresist film thickness range of 2.0–3.0 μm. It exhibits excellent adhesion to various substrates and boasts good resistance to wet-etching corrosion. |
| Photoresist and Polyimide | UV broad-spectrum photoresist | BN303 Series |
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Beijing Kehua Microelectronics Materials Co., Ltd. | The BN303 series UV negative photoresist is a type of negative photoresist that uses broad-spectrum ultraviolet exposure. It is primarily used for the fabrication of small- and medium-scale integrated circuits, discrete devices, and other microdevices. The viscosity of this product can be adjusted within the range of 29–100 mPa·s, and it covers a photoresist film thickness range of 0.85–2.1 μm. Its practical resolution can reach 5 μm, and it exhibits excellent adhesion to a variety of substrates as well as good resistance to wet etching. |
| Photoresist and Polyimide | UV broad-spectrum photoresist | BN308 Series |
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Beijing Kehua Microelectronics Materials Co., Ltd. | The BN308 series UV negative photoresist is a type of negative photoresist that uses broad-spectrum ultraviolet exposure, primarily intended for the fabrication of discrete devices and other microscale components. The viscosity of this product can be adjusted within the range of 140–500 mPa·s, and it covers a photoresist film thickness range of 2.2–6 μm. Its practical resolution can reach 8 μm, and it exhibits excellent adhesion to a variety of substrates as well as outstanding resistance to wet-etching corrosion. |
| Photoresist and Polyimide | UV broad-spectrum photoresist | BN310 Series |
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Beijing Kehua Microelectronics Materials Co., Ltd. | The BN310 series UV negative photoresist is a type of negative-tone photoresist that uses broad-spectrum ultraviolet exposure. It is primarily used for the fabrication of small- and medium-scale integrated circuits, discrete devices, and other microdevices. The viscosity of this product can be adjusted within the range of 27–39 mPa·s, and it covers a photoresist film thickness range of 0.85–1 μm. Its practical resolution can reach 2 μm, and it exhibits excellent adhesion on a variety of substrates. It contains an anti-halation dye, enabling its use on highly reflective substrates. |
| Photoresist and Polyimide | G-line photoresist | KMP E3100 Series |
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Beijing Kehua Microelectronics Materials Co., Ltd. | The KMP E3100 series photoresists are UV-negative photoresists specifically developed for the Lift-Off process. They utilize a phenolic resin system and are compatible with positive-tone processes (can be developed using standard positive-tone developers). The E3100 series offers multiple models with film thicknesses ranging from 1.0 to 4.5 μm, enabling it to meet the requirements of various processes for inverted-trapezoidal sidewalls. Additionally, these photoresists boast high resolution, a wide process window, and easy resist removal, making them widely used in the Lift-Off process during IC and LED chip manufacturing. |
| Photoresist and Polyimide | G-line photoresist | KMP E3200 Series |
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Beijing Kehua Microelectronics Materials Co., Ltd. | The KMP E3200 series photoresist is a UV-negative photoresist specifically developed for the Lift-Off process. Compared to the E3100, it features a thicker film thickness and covers a range of 6.0–12.0 μm. It boasts advantages such as adjustable inverted-trapezoidal profile, high resolution, a wide process window, and easy resist removal. This photoresist is widely used in the Lift-Off process during LED chip fabrication, particularly for high-power LED devices and flip-chip fabrication processes. |
| Photoresist and Polyimide | G-line photoresist | KMP EP3100 Series |
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Beijing Kehua Microelectronics Materials Co., Ltd. | The KMP EP3100 series photoresist is a positive photoresist designed for G/I-line exposure. It features fast photosensitivity and high resolution, and is primarily used in the manufacturing of LED chips, effectively boosting the productivity of chip manufacturers. |
| Photoresist and Polyimide | G-line photoresist | KMP EP3200 Series |
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Beijing Kehua Microelectronics Materials Co., Ltd. | The KMP EP3200 series photoresist is a positive-tone photoresist designed for G/I-line applications, primarily used in LED chip manufacturing. It features a moderate photosensitivity, high resolution, and a wide process window. Additionally, it exhibits excellent adhesion properties: without the use of HMDS, it maintains stable resist during development and prevents over-etching during wet etching. |
| Photoresist and Polyimide | G-line photoresist | KMP BP212 Series |
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Beijing Kehua Microelectronics Materials Co., Ltd. | The KMP BP212 series of photoresists are wide-spectrum positive photoresists designed for discrete devices. They are suitable for exposure using broad-spectrum, G-line, and I-line sources. This series is based on a phenolic resin/diazonaphthoquinone system. The products in this series come in various viscosities, enabling film thicknesses ranging from 0.75 μm to 2.5 μm. They offer advantages such as high resolution, fast photosensitivity, and a wide process window. |
| Photoresist and Polyimide | G-line photoresist | KMP BP218 Series |
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Beijing Kehua Microelectronics Materials Co., Ltd. | The KMP BP218 series photoresist is a positive-tone photoresist designed for discrete devices. It is suitable for exposure using broad-spectrum, G-line, and I-line wavelengths. This product belongs to the phenolic resin/diazonaphthoquinone system. The series offers various viscosities, enabling film thicknesses ranging from 1.0 μm to 2.0 μm. It boasts advantages such as high resolution, fast photosensitivity, and a wide process window. |
| Photoresist and Polyimide | I-line photoresist | KMP C6111 Series | Beijing Kehua Microelectronics Materials Co., Ltd. | The KMP C6111 series photoresist is a positive-type, thick-film i-line photoresist primarily used in IC manufacturing processes for PAD metal passivation layers and DNW deep-hydrogen ion-implanted layers when the photoresist film thickness is 5 μm. This series of photoresists features a wide process window and exhibits excellent resistance to etching, ion implantation, and ease of removal—meeting the stringent requirements of advanced integrated circuit manufacturing. It has been widely adopted by leading manufacturers of advanced integrated circuits. | |
| Photoresist and Polyimide | I-line photoresist | KMP C7500 Series |
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Beijing Kehua Microelectronics Materials Co., Ltd. | The KMP C7500 series photoresists are high-resolution i-line photoresists that feature a unique resin structure and a photosensitizer with exceptional resolution performance, enabling a resolution of 0.35 μm at a film thickness of 0.75 μm. This series of photoresists offers varying viscosities and a film thickness range of 0.5 to 2.0 μm. They also boast advantages such as fast photosensitivity, high resolution, and a wide process window, making them ideal for i-line layers in integrated circuit manufacturing processes that demand stringent resolution requirements. These photoresists have already been widely adopted by leading domestic integrated circuit manufacturing companies. |
| Photoresist and Polyimide | I-line photoresist | KMP C7300 Series |
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Beijing Kehua Microelectronics Materials Co., Ltd. | The KMP C7300 series photoresist is a high-resolution I-line photoresist that can achieve a resolution of 0.5 μm at a film thickness of 1.0 μm. This series offers products with varying viscosities, with film thicknesses ranging from 0.75 to 2.5 μm. It also boasts advantages such as fast photosensitivity, high resolution, and a wide process window, making it widely used by leading manufacturers in the advanced integrated circuit industry. |
| Photoresist and Polyimide | I-line photoresist | KMP C8300 Series |
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Beijing Kehua Microelectronics Materials Co., Ltd. | The KMP C8300 series photoresist is an I-line photoresist featuring high thermal resistance and excellent etch resistance. It employs a unique resin structure and formulation system that enables it to maintain its original morphology even after baking at 140 degrees Celsius. This series of photoresists offers varying viscosities, with film thicknesses ranging from 1.0 to 4.0 μm and a resolution as fine as 0.6 μm. Additionally, it boasts advantages such as fast photosensitivity, high resolution, and a wide process window, making it well-suited for implantation and metal-layer processes in integrated circuit manufacturing. It has been widely adopted by leading domestic integrated circuit manufacturers. |
| Photoresist and Polyimide | I-line photoresist | KMP C5300 Series |
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Beijing Kehua Microelectronics Materials Co., Ltd. |
The KMP C5300 series photoresist is a universal positive-tone photoresist suitable for G/I-line applications. At a film thickness of 1.2 μm, it can achieve a resolution of 0.6 μm. This series of photoresists features fast photosensitivity (with an Eop value of 65 mJ/cm² at 1.25 μm). The series offers products with varying viscosities, covering a film thickness range from 0.75 to 2.5 μm. Additionally, this photoresist boasts advantages such as rapid photosensitivity, high resolution, and a wide process window. It is particularly well-suited for i-line layers in integrated circuit manufacturing processes where high resolution requirements are not critical. This photoresist has already been widely adopted by leading domestic integrated circuit manufacturing companies.
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| Photoresist and Polyimide | KrF photoresist | KMP DK1080 | Beijing Kehua Microelectronics Materials Co., Ltd. |
KMP DK1080 is China’s first commercially available 248nm DUV (KrF) photoresist, independently developed by our company and now being supplied in volume to leading domestic integrated circuit manufacturing enterprises.
KMP DK1080 is suitable for the implant layer process in integrated circuit manufacturing. Even without using a bottom antireflective coating (BARC), it can effectively eliminate standing-wave effects caused by interference, resulting in steep sidewall profiles. Its film thickness range is 6,000–9,000 Å, with a resolution of up to 0.25 μm. Additionally, it features rapid photosensitivity and an excellent process window.
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| Photoresist and Polyimide | UV broad-spectrum photoresist | KMP CP4800 Series |
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Beijing Kehua Microelectronics Materials Co., Ltd. | The KMP CP4800 series photoresist is a positive-type, thick-film photoresist specifically designed for advanced packaging processes. Its film thickness can range from 10 to 40 μm and it features high resolution and excellent thermal resistance. It is compatible with both KOH and TMAH developers and has already been put into commercial mass production by packaging companies in mainland China and Taiwan. |
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