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Hubei Dinglong Holding Co., Ltd.

Hubei Dinglong Co., Ltd.

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Materials company

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Product Description

Product Category Secondary Category Product Name Image introduction Manufacturer Product Features
Polishing material Polishing pad Copper polishing pad Hubei Dinglong Holding Co., Ltd. Chemical Mechanical Polishing Pad: Longer pad life due to low cut rate
Balanced performance between removal rate and defects
Mature product with stable performance
Variable grooving design
PSA with strong peel strength and excellent thermal stability
Sub-pad with outstanding non-absorbency of water
Both non-window and window products can be provided.
Suitable for both 200mm and 300mm wafers
Polishing material Polishing pad Oxide polishing pad Hubei Dinglong Holding Co., Ltd. Chemical Mechanical Polishing Pad: Longer pad life due to low cut rate
Balanced performance between removal rate and defects
Mature product with stable performance
Variable grooving design
PSA with strong peel strength and excellent thermal stability
Sub-pad with outstanding non-absorbency of water
Both non-window and window products can be provided.
Suitable for both 200mm and 300mm wafers
 
Polishing material Polishing pad Tungsten polishing pad Hubei Dinglong Holding Co., Ltd. Chemical Mechanical Polishing Pad: A specially designed pad that enhances copper performance. The polishing pad significantly improves defectivity, dishing, and erosion.
Longer pad life due to low cut rate
Balanced performance between removal rate and defects
Mature product with stable performance