Hubei Dinglong Holding Co., Ltd.
Hubei Dinglong Co., Ltd.
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Materials company
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Product Description
| Product Category | Secondary Category | Product Name | Image introduction | Manufacturer | Product Features |
| Polishing material | Polishing pad | Copper polishing pad |
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Hubei Dinglong Holding Co., Ltd. |
Chemical Mechanical Polishing Pad: Longer pad life due to low cut rate Balanced performance between removal rate and defects Mature product with stable performance Variable grooving design PSA with strong peel strength and excellent thermal stability Sub-pad with outstanding non-absorbency of water Both non-window and window products can be provided. Suitable for both 200mm and 300mm wafers |
| Polishing material | Polishing pad | Oxide polishing pad |
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Hubei Dinglong Holding Co., Ltd. |
Chemical Mechanical Polishing Pad: Longer pad life due to low cut rate Balanced performance between removal rate and defects Mature product with stable performance Variable grooving design PSA with strong peel strength and excellent thermal stability Sub-pad with outstanding non-absorbency of water Both non-window and window products can be provided. Suitable for both 200mm and 300mm wafers |
| Polishing material | Polishing pad | Tungsten polishing pad |
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Hubei Dinglong Holding Co., Ltd. |
Chemical Mechanical Polishing Pad: A specially designed pad that enhances copper performance. The polishing pad significantly improves defectivity, dishing, and erosion. Longer pad life due to low cut rate Balanced performance between removal rate and defects Mature product with stable performance |
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