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Ta target for 200mm silicon wafer process

Ningbo Jiangfeng Electronic Materials Co., Ltd.

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Target material

Product accessories:

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Product Description

1. Purity ≥ 99.95%;

2. Welding pass rate ≥ 99%;

3. Machining accuracy: 0.1 mm;

4. Sputtering surface roughness ≤ 0.4 μm

5. Grain size ≤ 100 µm

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Co target material for 300mm silicon wafer processes

W and Alloy Targets for 300mm Silicon Wafer Processes

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Co target material for 300mm silicon wafer processes

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W and Alloy Targets for 300mm Silicon Wafer Processes