Sulfuric acid (H2SO4, 96% concentration)
Recommendation rating: ★★★★ Hubei Xingfu Electronic Materials Co., Ltd.
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Process chemicals
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Product Description
It can be used to remove metals and organic contaminants from the surface of silicon wafers, and is also suitable for wet etching during photolithography as well as for final photoresist removal. Metal ion concentration: <50 ppt; particle size: 0.5 μm <10, 0.3 μm <20, 0.2 μm <100.
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