Silicon Chemical Mechanical Polishing Slurry Series
Recommendation rating: ★★★★ Anji Microelectronics (Shanghai) Co., Ltd.
Category:
Polishing material
Product accessories:
Contact Us
Product Description
Product Features: Coarse Polishing Liquid: High grinding rate (1–2 micrometers/minute), high dilution ratio (1:20 to 1:40). Fine Polishing Liquid: Ultra-low surface defects, ultra-low surface roughness, high dilution ratio (1:10 to 1:20).
Previous page
© 2025 Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance
Beijing Public Security Bureau Filing No. 11010102005379
Website construction:China Enterprise DynamicsBeijing