Copper/Barrier Layer Chemical Mechanical Polishing Slurry Series

Recommendation rating: ★★★★★ Anji Microelectronics (Shanghai) Co., Ltd.

Category:

Polishing material

Product accessories:

Product Description

Product Features: Copper Polishing Liquid: High grinding rate (0.5–1 μm/min), high dilution ratio (≥10x); Barrier Layer Polishing Liquid: High grinding rate (0.1 μm/min), adjustable selectivity ratio.

Silicon Chemical Mechanical Polishing Slurry Series

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Materials Alliance

Phone:(010) 82359930

Beijing Public Security Bureau Filing No. 11010102005379

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