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Accelerating the Localization of Large Silicon Wafers, ESWIN Completes Series B Financing

Accelerating the Localization of Large Silicon Wafers, ESWIN Completes Series B Financing

Source:
2021/07/30
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Recently, Xi'an ESWINl Materials Technology Co., Ltd. (hereinafter referred to as "ESWIN") completed a Series B financing with a financing amount of over RMB 3 billion.

The integrated circuit industry is a strategic and basic industry that supports economic and social development. Silicon wafers are an indispensable material for chip manufacturing. Large 12-inch (300 mm) silicon wafers are currently the most in demand, cost-proportioning, and low-localized core material among chip materials. As of 2020, 95% of this material is still dependent on imports.