From November 14 to 15, 2013, the Integrated Circuit Materials & Components Industry Technology Innovative Alliance (hereinafter referred to as the "Alliance") convened a meeting in Shanghai to review the draft "Integrated Circuit Materials Industry Technology Development Roadmap" (hereinafter referred to as the "Roadmap"). Secretary General Shi Ying presided over the meeting. More than 60 representatives attended the meeting, including the expert group and 11 representatives from the professional working group of the “Roadmap”. The expert group gathered the Alliance Expert Advisory Committee (hereinafter referred to as the “Advisory Committee”) and members of the Alliance council, including Professor Yang Deren, Deputy Director of the Advisory Committee and Director of the Institute of Semiconductor Materials of Zhejiang University, Liu Zhiguo, member of the Advisory Committee and Professor of Nanjing University, Zhao Chaoyan, Researcher of Institute of Microelectronics of the Chinese Academy of Sciences, Zhang Xin, Professor of Fudan University, Dr. Xu Congying, Vice President of Nata Optoelectronics, and Dr. Wang Shumin, Chairman and CEO of Anji Microelectronics, etc.
The meeting lasted one and a half days, and 11 professional working groups including sub-market, substrate materials, masking, photoresists, polishing materials, target materials, electronic gases, chemicals, special packaging materials, and new materials reported the "Roadmap" draft more than 700 pages to the participating experts, which mainly involved the analysis to domestic IC material market and related industry, current situation and competition situation of materials industry, domestic and international industrial development environment, related plans, technology and industrial development roadmap, policy and measures and so on. The expert group listened to the report on the draft of each professional working group item by item, fully affirmed the staged achievements of the compilation of the “Roadmap”, seriously inquired about the doubts in the report, proposed pertinent amendments to the report, and presented specific recommendations on the overall compilation, publication and other work of the “Roadmap”.
Secretary General Shi Ying expressed thanks to the efforts for the hard work made by everyone and requested to continue to improve relevant information in the next month, including but not limited to extending the corresponding planning and forecasting to 2020 and matching with relevant national plans, supplementing information about the business management, R&D investment, product and technology layout and successful experience of international competitors, and adding operability suggestions for building China's integrated circuit material industry innovation platform and improving innovation capabilities.
Previously, the Alliance had convened two meetings around the compilation of the “Roadmap”, that is the kick-off meeting about the compilation of “Roadmap” held in Beijing on August 23, 2013 and the working group leader meeting convened in Quzhou on September 28. A total of 40 enterprises and institutions including domestic main integrated circuit material user units such as SMIC, Huahong NEC, China Resources Shanghua, Changjiang Electronics Technology, Tongfu Microelectronics and major materials research units Shanghai Simgui, Grinm Semiconductor, Beijing Kempur, Nata Optoelectronics, Shanghai Sinyang, Anji Microelectronics, Jiangfeng Electronics, Yantai Deppon, and Shanghai Institute of Microsystems of the Chinese Academy of Sciences participated in the work.