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The First Advanced Electronic Packaging Materials Technology Forum was successfully held

The First Advanced Electronic Packaging Materials Technology Forum was successfully held

Source:
2013/11/15
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 On November 18, 2013, the First Advanced Electronic Packaging Materials Technology Forum proposed and supported by the Materials Alliance was successfully held in Shenzhen. With the theme of “Development and Industrialization of Key Materials for Next-Generation Electronic Packaging”, this forum explored China's electronic packaging materials and development models, and discussed the establishment of smooth communication channels for industry, university and research.