Product platform
Product platform
+
  • 研磨机.jpg

Grinding machine

Category:

Joint Analysis, Testing, and Technology Cooperation Service Platform

Testing instrument

Silicon Material Testing Instrument

Product accessories:

Contact Us

Product Description

Instrument and Equipment Information

Instrument Name

Grinding machine

Instrument model

metaserv250

English: None yet

Place of origin and manufacturer

BUEHLER

Affiliated Unit

Jiangsu Xinhua Semiconductor Materials Technology Co., Ltd.

Acquisition time

Not available yet

Placement location

No. 66, Yangshan Road, Xuzhou Development Zone

Instrument Status

Normal

Device application range / Instrument measurement range (tolerance)

The silent belt-driven grinding disc makes the operation quieter and more stable.

The base is cast from corrosion-resistant materials with added weight, ensuring the machine has a long service life even under harsh conditions.

Safety: Built-in circuit self-protection devices and an emergency stop button ensure that grinding and polishing operations are safer and more reliable.

Easy and convenient to operate, with excellent applicability and stability.

Grinding wheel speed: continuously adjustable from 50 to 500 rpm;

Control method: Push-button type, for water supply, start/stop, and load control;

Grinding wheel size: 10 inches (254 mm) in diameter, dual-disc system.

Whether it is regularly calibrated by a third-party agency

Yes

CNAS certification obtained.

No

 

Previous page

Ion chromatography

Microwave Digestion System

Next page

Previous page

Ion chromatography

Next page

Microwave Digestion System