Branch Committee Member Zhang Wei
Vice Dean of the School of Microelectronics, Fudan University
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2017
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Zhang Wei, Professor and Doctoral Supervisor, currently serves as the Vice Dean of the School of Microelectronics at Fudan University. His research focuses on extreme-scale integrated circuit processes, semiconductor materials, and microelectronic devices. He has achieved a series of innovative breakthroughs in areas such as advanced copper interconnect technologies for extreme-scale integrated circuits, atomic layer deposition processes, and novel memory devices. He is a member of the Academic Committee of Fudan University, an expert in the overall group of the National Major Special Project (Project 02), an expert reviewer for national science and technology awards, an expert in the Shanghai Municipal Working Group for Promoting Strategic Emerging Industries, an expert in the working group studying the discipline development strategy for “Post-Moore Era Micro- and Nano-Electronics” jointly organized by the National Natural Science Foundation of China and the Chinese Academy of Sciences, and an expert in the expert panel for the “Development Strategy Study of the Integrated Circuit Industry in the Yangtze River Delta Region” jointly conducted by the Chinese Academy of Engineering and the Shanghai Municipal Government. In recent years, he has published over 200 SCI papers and filed more than 180 invention patent applications, including over 30 U.S. patents.
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