Wire Bonding Machine
Category:
Joint Analysis, Testing, and Technology Cooperation Service Platform
Process equipment
Other process equipment
Product accessories:
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Product Description
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Instrument and Equipment Information |
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Instrument Name |
Wire bonding machine |
Instrument model |
Palomar 8000 |
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English: None yet |
Place of origin and manufacturer |
United States/Palomar |
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Affiliated Unit |
Hua Jin Semiconductor Packaging Leading Technology R&D Center Co., Ltd. |
Acquisition time |
November 2009 |
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Placement location |
No. 3, Beitucheng West Road, Chaoyang District, Beijing |
Instrument Status |
Normal |
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Device application range / Instrument measurement range (tolerance) |
Bonding is possible. Bonding Method: Thermal Ultrasonic Ball Bonding; Deep Cavity Capability: ≥20 mm; Lead Wire Diameter Range: 0.7–2.0 mil; Repeatability Accuracy: < ±2.5 µm; Image Recognition: < ±7°; XY-axis Resolution: 0.2 µm. |
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Whether it is regularly calibrated by a third-party organization |
No |
CNAS certification obtained. |
No |
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