Laser drilling machine
Category:
Joint Analysis, Testing, and Technology Cooperation Service Platform
Process equipment
Other process equipment
Product accessories:
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Product Description
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Instrument and Equipment Information |
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Instrument Name |
Chinese: Laser drilling machine |
Instrument model |
FLEX5330 |
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English: None yet |
Place of origin and manufacturer |
Singapore/ESI |
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Affiliated Unit |
Hua Jin Semiconductor Packaging Leading Technology R&D Center Co., Ltd. |
Acquisition time |
November 2011 |
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Placement location |
No. 3, Beitucheng West Road, Chaoyang District, Beijing |
Instrument Status |
Normal |
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Device application range / Instrument measurement range (tolerance) |
Laser drilling is used to create holes in the sheet material. Number of lasers: 1; Laser wavelength: 355 nm; Laser power: ≤11 W; Blind hole aperture tolerance: 50 μm ±10%, 4 Sigma; Hole ratio (taper): >80% (for 50 μm aperture) |
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Whether it is regularly calibrated by a third-party organization |
No |
CNAS certification obtained. |
No |
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