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Scanning Electron Microscopy - Electron Backscatter Diffraction

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Product Description

Instrument and Equipment Information

Instrument Name

Scanning Electron Microscopy - Electron Backscatter Diffraction

Instrument model

Hitachi SU3500

SEM-EDX-EBSD

Place of origin and manufacturer

Import

Affiliated Unit

Ningbo Jiangfeng Electronic Materials Co., Ltd.

Acquisition time

2018

Placement location

No. 198, Anshan Road, Economic Development Zone, Yuyao City, Ningbo, Zhejiang Province

Instrument Status

Normal

Device application range / Instrument measurement range (tolerance)

SEM can analyze the microtopography of samples with magnifications ranging from 10,000 to 30,000 times. DEX enables quantitative compositional analysis of sample surfaces (on flat, polished, and uniform surfaces). The key feature of EBSD is that it combines the conventional advantages of scanning electron microscopy with diffraction-based spatial resolution at sub-micron levels. Using EBSD technology, one can characterize the crystallographic orientation of grains, orientation differences, grain boundary properties, perform 3D microstructure reconstruction via layering techniques, analyze orientation gradients within individual grains, and explore extended applications related to Kikuchi patterns—such as evaluating defect densities and performing phase analyses.

Whether it is regularly calibrated by a third-party agency

Yes

CNAS certification obtained.

No