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Al and its alloy targets for 300mm silicon wafer processes

Recommendation rating: ★★★★★ Ningbo Jiangfeng Electronic Materials Co., Ltd.

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Product Description

1. Purity ≥ 99.9995%;

2. Welding pass rate ≥ 99%;

3. Machining accuracy: 0.1 mm;

4. Sputtering surface roughness ≤ 0.4 µm

5. Grain size ≤ 100 μm;

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Ta target for 300mm silicon wafer processes

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