Liu Weidong

Director, Tianshui Huatian Electronics Group

Category:

Director

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Product Description

I graduated from Xi'an University of Electronic Science and Technology with a bachelor's degree in July 2008, majoring in Microelectronics.
From July 2008 to June 2011, I worked at Xingke Jinpeng as a Packaging Process Engineer and an NPI Engineer. From June 2011 to January 2015, I served as the R&D Manager at Huatian Technology’s Xi’an Packaging Technology Research Institute, where I led the establishment of Huatian’s FC product line—including the development of design specifications, documentation systems, and the formation of the engineering team.
From January 2015 to January 2019, served as the Director of the Xi'an Research Institute at Huatian Technology, responsible for the design, simulation, and R&D of new substrate-based products. The customized packaging product for CPUs based on the 16nm process, which I led, was successfully put into mass production and testing—marking the first domestically produced project to achieve mass production using the 16nm process.
Since January 2019, I have served as the Director of Technology Marketing at Huatian Technology’s Management Headquarters and concurrently as the Director of Technology Marketing at Huatian Technology (Nanjing) Co., Ltd. I have spearheaded the company’s further R&D efforts in the areas of 2.5D/3D packaging, heterogeneous integration SiP, and large-size FCBGA packaging, aiming to meet the demands of markets and customers in sectors such as 5G, AI, HPC, and big data, thereby positioning Huatian as a leader in high-end packaging solutions within the industry.

Materials Alliance

Phone:(010) 82359930

Beijing Public Security Bureau Filing No. 11010102005379

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