Ti target for 200mm silicon wafer processing
Recommendation rating: ★★★★ Ningbo Jiangfeng Electronic Materials Co., Ltd.
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Target material
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Product Description
1. Purity ≥ 99.995%;
2. Welding pass rate ≥ 99%;
3. Machining accuracy: 0.1 mm;
4. Sputtering surface roughness ≤ 0.4 μm
5. Grain size ≤ 20 µm
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