Ching Ping Wong Honorary Chairman
Professor CP Wong is a lecturer professor of electrical engineering at the Chinese University of Hong Kong, dean of the School of Engineering, and a director professor at Georgia Institute of Technology, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, “Advanced Electronic Packaging Materials”, Guangdong Province Innovation Team Leader, Chief Scientist , Academician of the American Academy of Engineering (2000), Foreign Academician of the Chinese Academy of Engineering (2013). He has been engaged in the research of electronic packaging for a long time. Because of his pioneering contributions in this field for decades, he was awarded the highest honorary award in the field of electronic packaging by IEEE-IEEE component, packaging and manufacturing technology award, and is regarded as the "father of modern semiconductor packaging ", Has now been generally recognized by the industry.
Professor Wang Zhengping is one of the pioneers of plastic packaging technology. He innovatively used silicon resin to encapsulate the gate controlled diode switch (GDX) and realized the use of polymer materials to seal the equivalent GDX structure, which significantly improved the reliability of the package. This plastic packaging technology overcomes the traditional ceramic package heavy weight and process The complex and high cost issues have been comprehensively promoted by Intel and IBM. At present, plastic packaging technology accounts for more than 95% of the world's integrated circuit packaging market. He also solved the problem of unstable contact resistance between the conductive adhesive and the device interface that has long plagued the packaging industry. This innovative technology has been used in conductive adhesive products of companies such as Henkel (Henkel). Professor Wang has developed a solvent-free, high Tg non-flowable underfill for the first time in the industry, which simplifies the flip-chip packaging process and improves the excellent rate and reliability of the device.
He has traveled between China and the United States for many years to promote the development of Chinese electronic packaging technology in academic, industrialization and international cooperation. Efforts to cultivate talents for the country, help establish international cooperation with the National Packaging Research Center of the United States, and build an e-packaging talent echelon for the country; after serving as the dean of the School of Engineering at the Chinese University of Hong Kong, take reform measures to strive to cultivate high-end scientific research talents; As the leader, Shenzhen Advanced Technology Research Institute successfully established the "Advanced Electronic Packaging Materials Guangdong Innovative Research Team" to improve China's integrated circuit upstream and downstream industry chain, and create an international level demonstration platform for the development and transformation of electronic packaging materials.