Shennan Circuit Co., Ltd. Successfully Listed on the Shenzhen Stock Exchange.

On December 13, 2017, Shenzhen South Circuit Co., Ltd. officially launched its initial public offering of A-shares. The stock’s abbreviated name is “Shenzhen South Circuit,” and its stock code is 002916. According to Lei, Chairman of Shenzhen South Circuit, after more than thirty years of development, the company has become a leading enterprise in its industry. Listing on the capital market marks another milestone in the company’s development. In the future, the company will make good use of the capital market platform to further improve corporate governance and continue to strengthen, optimize, and expand its business. Shenzhen South Circuit focuses on the field of electronic interconnection and is committed to becoming “a world-class integrator of electronic circuit technologies and solutions.” The company specializes in printed circuit boards, packaging substrates, and electrical...

On December 13, 2017, Shenzhen South Circuit Co., Ltd. officially listed its initial public offering of A-shares. The stock’s abbreviated name is “Shenzhen South Circuit,” and its stock code is 002916.

Yu Lei, Chairman of Shenzhen South Circuit, stated that after more than three decades of development, Shenzhen South Circuit has become a leading enterprise in the industry. Listing on the capital market represents another milestone in the company’s development. In the future, the company will make good use of the capital market platform to further improve corporate governance and continue to strengthen, optimize, and expand its business.

Shennan Circuit focuses on the field of electronic interconnection and is committed to becoming a “world-class integrator of electronic circuit technologies and solutions.” The company operates in three core business segments—printed circuit boards, packaging substrates, and electronic assembly—and has established a unique “3-in-1” business model in the industry: centered on interconnection, it continues to strengthen its leading position in the printed circuit board business while vigorously developing its packaging substrate business, which shares the same technological roots, and its electronic assembly business, which serves the same customer base. The company boasts comprehensive manufacturing capabilities spanning “sample production → small-to-medium volume production → large-scale production,” and offers customers professional, efficient, and one-stop integrated solutions by providing end-to-end value-chain services that include solution design, manufacturing, electronic assembly, micro-assembly, and testing.

Key words: