Shanghai Xinyang expects its 2017 profit to reach 75 million, representing a 38% year-on-year increase.

Shanghai Xinyang recently disclosed its 2017 annual performance forecast, estimating that its profit for 2017 will range from 68 million to 75 million yuan, representing a year-on-year increase of 25% to 37.87%. Shanghai Xinyang stated that the rise in net profit during the reporting period compared to the same period last year was primarily driven by a year-on-year increase in revenue from its core business. Since 2017, in the traditional packaging sector, Shanghai Xinyang’s wafer dicing blade products have gradually ramped up production and have already achieved profitability. In the semiconductor manufacturing sector, its wafer chemical products continue to see rapid growth as production scales up, and these wafer chemicals have now been adopted by SMIC, Hynix Wuxi, and HuaLi.

Shanghai Xinyang recently disclosed its 2017 annual performance forecast, estimating that the company’s profit for 2017 will range from 68 million to 75 million yuan, representing an increase of 25% to 37.87% over the same period last year.

Shanghai Xinyang stated that its net profit for the reporting period increased year-on-year, primarily due to a rise in its core business revenue compared to the same period last year.

Since 2017, in the traditional packaging sector, Shanghai Xinyang has gradually increased production of wafer dicing blades and has already achieved profitability. In the semiconductor manufacturing sector, its wafer chemical products continue to ramp up production at a rapid pace, and these chemicals have been adopted by customers including SMIC, Hynix Wuxi, HuaLi Microelectronics, Tongfu Microelectronics, Suzhou Jingfang, and Changdian Advanced Packaging. Specifically, in the area of chip copper interconnect plating solutions, Shanghai Xinyang’s products have become the baseline for SMIC’s 28nm technology node and the baseline for Hynix Wuxi’s 32nm technology node. Furthermore, copper-process cleaning solutions and aluminum-process cleaning solutions for wafer fabrication processes have both begun to be supplied. In the IC packaging substrate sector, Shanghai Xinyang’s electroplating copper additive products remain in the supply phase.

In addition, Shanghai Xinyang has been included in TSMC’s list of qualified suppliers and is currently undergoing product verification. Its affiliated subsidiary, Shanghai Xinsheng Semiconductor Technology Co., Ltd., began delivering 300mm large silicon wafer samples to chip foundries such as SMIC starting from the second quarter of 2017 for certification purposes, and progress on this project is currently going smoothly. Meanwhile, Shanghai Xinyang is also actively expanding horizontally into other application areas of functional chemical materials, making proactive efforts and laying out plans in several new product segments, including industrial specialty coatings and surface treatment chemicals for automotive components.

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