The 2024 China Semiconductor Materials Innovation and Development Conference was successfully held in Guangzhou.

From May 23 to 24, the Integrated Circuit Materials Innovation Alliance (hereinafter referred to as the “Materials Alliance”), together with the Supporting Industries Branch of the China Semiconductor Industry Association, hosted the “2024 China Semiconductor Materials Innovation and Development Conference” in Guangzhou. More than 280 experts, senior executives, and representatives from integrated circuit manufacturing, packaging and testing, materials companies, and research institutions attended the conference.

Wang Luping, rotating chairman of the Materials Alliance, chaired this conference. The forum session featured special presentations by renowned industry experts: Shen Na, supply chain management expert at Jiangsu Changdian Technology Co., Ltd.; Liu Xianbing, Chairman and General Manager of Suzhou Kema Materials Technology Co., Ltd.; Zhou Ming, General Manager of Samytech Advanced Materials Co., Ltd.; Liu Qingchao, Chief Marketing Officer of Xi'an Yisiwei Materials Technology Co., Ltd.; Sun Yu, Sales Director of Daikin Qingyan Advanced Technology (Huizhou) Co., Ltd.; Jia Xinyuan, Director of Semiconductor Application Development at Shenzhen Xinzhoubang Technology Co., Ltd.; Liu Qianfa, Director of the National Engineering Research Center for Electronic Circuit Base Materials at Guangdong Shengyi Technology Co., Ltd.; and Mike Walden, Senior Director of Market Research and Analysis at TECHCET. These experts delivered insightful reports covering a wide range of topics—from international market trends to domestic developments, from cutting-edge technologies to innovative pathways, from end-use applications to raw materials, and from market dynamics to industrial breakthroughs—providing a comprehensive exploration of the materials industry’s development.

In her presentation titled “An Exploration of Key Advanced Packaging Materials,” Ms. Shen Na, a supply chain management expert at Jiangsu Changdian Technology Co., Ltd., pointed out that as the semiconductor industry continues to pursue higher performance and smaller package sizes, the requirements for various packaging materials are also evolving. At the packaging substrate level, materials are expected to have lower coefficients of thermal expansion and superior capabilities for fine-line fabrication and processing. In terms of underfill adhesives and molding compounds, products need to exhibit better fluidity and filling performance, as well as improved coefficients of thermal expansion to minimize product warping. Furthermore, photoresists must offer higher resolution and be suitable for even finer line patterning.

In his report titled “Advanced Ceramic Materials and Components for Semiconductor Equipment,” Liu Xianbing, Chairman and General Manager of Suzhou Kema Materials Technology Co., Ltd., highlighted that advanced ceramic materials, thanks to their highly stable properties, ensure reliable equipment operation even under extreme conditions, thereby enhancing both production efficiency and product quality. As the semiconductor industry continues to grow and technology advances, the demand for advanced ceramic materials and components is steadily increasing. Moreover, the forms of certain components have evolved—such as ceramic electrostatic chucks and ceramic heaters, which have gradually integrated multiple functions previously performed by separate components. To meet market demands, the industry is continuously exploring new material synthesis methods and manufacturing technologies aimed at improving material performance. However, this field still faces several challenges, including the complexity of manufacturing processes and cost pressures. Therefore, in the future, the industry will place greater emphasis on innovation in material design and optimization of manufacturing processes to address these challenges and drive the continued development of the semiconductor industry.

In his presentation titled “Fine Graphite—The Cornerstone of Semiconductor Material Manufacturing,” Zhou Ming, General Manager of Saimaike Advanced Materials Co., Ltd., elaborated on the property characteristics of graphite materials, the applications of high-purity graphite materials in semiconductor manufacturing, and the solutions offered by the PYROCⓇ series of fine graphite in the semiconductor sector. He also identified key control points for the design of fine graphite products from the perspectives of product design philosophy and selection of basic product functions. The presentation further provided an overview of current industrial practices in the industry. Additionally, it proposed recommendations for enhancing the performance of graphite and carbon materials in semiconductor manufacturing and offered insights and suggestions for the collaborative development of the future semiconductor supply chain.

Liu Qingchao, Chief Marketing Officer of Xi'an Yisiwei Materials Technology Co., Ltd., delivered a speech titled “Facing the Gaps, Steadfastly Moving Forward, and Comprehensively Strengthening the Foundation of the 12-Inch Silicon Wafer Industry” at the conference. He stated that, thanks to substantial investments from both the national government and enterprises, China’s 12-inch silicon wafer industry has achieved leapfrog development, and the pace of domestic production has significantly accelerated. Currently, domestic manufacturers are already capable of supplying 12-inch silicon wafers required for various client-end products, essentially achieving comprehensive coverage across all product types. However, compared with the world’s top five silicon wafer manufacturers, domestic companies still have certain gaps in terms of technological level and market share, making it imperative for them to further enhance their competitiveness to meet the growing demands of the market. Looking ahead, domestic silicon wafer manufacturers must closely keep pace with global cutting-edge technological developments, increase R&D investment, break through core technology barriers, continuously optimize silicon wafer performance, and improve product yield rates to meet the increasingly stringent requirements of downstream customers. At the same time, they should also strengthen cooperation with advanced upstream and downstream partners both domestically and internationally, build a well-rounded industrial ecosystem, and comprehensively solidify the foundation of China’s 12-inch silicon wafer industry.

Sun Yu, Sales Director of Daikin Qingyan Advanced Technology (Huizhou) Co., Ltd., highlighted in the report “Daikin Semiconductors” the applications of Daikin products in semiconductor manufacturing processes, Daikin’s supply chain, product development roadmap, semiconductor-related products, and provided a detailed overview of Daikin’s perfluoroelastomer sealing ring factory and its products.

Jia Xinyuan, Director of Semiconductor Application Development at Shenzhen Xinzhoubang Technology Co., Ltd., delivered a presentation titled “Applications and Development of Fluorinated Liquids in the Semiconductor Industry.” He explained that in recent years, major overseas manufacturers of fluorinated liquid products have successively announced the cessation of production due to environmental concerns. Consequently, environmentally friendly fluorinated liquids capable of operating at both high and ultra-low temperatures will become the mainstream products, providing precise and stable temperature control for new processes and supporting the advancement of cutting-edge manufacturing technologies.

In his report titled “Advanced Packaging Materials for High-Power, High-Computing-Performance Applications,” Liu Qianfa, Director of the National Engineering Research Center for Electronic Circuit Base Materials at Guangdong Shengyi Technology Co., Ltd., pointed out that as Moore’s Law gradually approaches its physical limits, advanced packaging technology has become a crucial development direction for sustaining Moore’s Law. The rise of generative AI and large-scale models is further driving semiconductor packaging materials toward greater system integration, higher transmission rates, and superior thermal conductivity. From the perspective of electronic interconnection and packaging, the report outlines technological development trends for various application fields—including AI servers and power semiconductors—and the corresponding requirements for semiconductor packaging materials. Using typical products as examples, the report also illustrates specific application scenarios and material solutions.

Mike Walden, Senior Director of Market Research and Analysis at TECHCET, delivered a video report titled “Growth in Semiconductor Materials and Market-Supporting Technologies.” He noted that the semiconductor industry faced continued sluggishness in 2023, but anticipates a mixed recovery in 2024. This recovery is expected to lead to improved revenue growth for semiconductor materials and drive further advancements, as new device architectures will demand novel material solutions. Coupled with the ongoing trend of chip-factory expansions, this outlook paints a positive picture for the materials market.

That afternoon, the Materials Alliance concurrently held a special matchmaking session focused on Yuexin Semiconductor. Forty domestic material suppliers engaged in closed-door discussions with representatives from Yuexin’s supply chain. Mr. Luo Jianlun, Senior Director of Procurement at Yuexin Semiconductor Technology Co., Ltd., attended the meeting and briefed the attending material company representatives on Yuexin’s current development status and its material requirements. During the interactive session, he addressed several issues of widespread concern among material companies, including the application of domestically produced materials, the selection of dual-source suppliers, and support services for manufacturing systems. This specialized matchmaking session marked the second time the Materials Alliance has collaborated with Yuexin to organize such an exchange event. It provided a platform and strong support for strengthening cooperation between leading regional manufacturers and local supply chains, while also offering new entrants in the materials industry valuable opportunities to connect directly with end-users.

Concurrently with the conference, the 4th Biannual Board of Directors Meeting of the Materials Alliance was held. Nearly a hundred representatives from the alliance’s board member organizations attended the meeting. The Secretariat provided a comprehensive report to the attendees on the alliance’s 2023 work summary and its plans for the next phase. The meeting also reviewed issues such as changes in board members and discussed other matters, and conducted voting on applications from newly joining enterprises. During the board meeting, outstanding information collectors who had demonstrated exceptional performance in the collection of data on the mass production and application of domestically produced materials were also recognized and honored.