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Historical Overview of the 2023 China Semiconductor Materials Innovation and Development Conference

2023 China Semiconductor Materials Innovation and Development Conference

2023 marks the inaugural year for fully implementing the spirit of the 20th National Congress of the Communist Party of China and the year in which “specialization, refinement, uniqueness, and innovation” will be vigorously promoted. To pool the strengths of China’s integrated circuit manufacturing industry across the entire value chain, bring together talents from various fields, and enhance connectivity between upstream and downstream sectors of the integrated circuit materials industry, the Integrated Circuit Materials Innovation Alliance (hereinafter referred to as the “Materials Alliance”), the Semiconductor Supporting Industries Branch of the China Semiconductor Industry Association, in collaboration with the Integrated Circuit Branch of the China Semiconductor Industry Association, the Integrated Circuit Equipment Innovation Alliance, the Integrated Circuit Components Innovation Alliance, the Integrated Circuit Packaging and Testing Innovation Alliance, and the China Integrated Circuit Testing and Inspection Innovation Alliance, will jointly host the “25th China Integrated Circuit Manufacturing Annual Conference & Supply Chain Innovation Development Conference,” themed “Standing at a New Stage of Development and Building a New Development Pattern for the Chip Industry.” During this event, the Materials Alliance will also organize the “2023 China Semiconductor Materials Innovation and Development Conference.”

The 2023 China Semiconductor Materials Innovation and Development Conference will focus on global trends in the semiconductor materials industry under the new circumstances and the current state of China’s materials industry development. Industry experts and senior executives from leading companies will be invited to jointly discuss the new material requirements driven by integrated circuit manufacturing, the latest technological highlights in various materials fields, and innovative approaches for strengthening collaboration across industries. This will help all stakeholders in China’s integrated circuit materials sector adopt a more proactive, confident, open, and inclusive mindset, work together to promote industry development, and build a new industrial landscape.

I. Conference Organizing Committee

Guiding Unit:

Office for the Implementation and Management of the National Major Science and Technology Project on Ultra-Large-Scale Integrated Circuit Manufacturing Equipment and Complete Process Technologies

China Semiconductor Industry Association

China Integrated Circuit Innovation Alliance

Guangdong Provincial Department of Industry and Information Technology

Guangdong Provincial Development and Reform Commission

Guangdong Provincial Department of Science and Technology

Guangzhou Municipal Bureau of Industry and Information Technology

Organizer:

China Integrated Circuit Materials Innovation Alliance

Semiconductor Supporting Industries Branch of the China Semiconductor Industry Association

Integrated Circuit Branch of the China Semiconductor Industry Association

China Integrated Circuit Packaging and Testing Innovation Alliance

China Integrated Circuit Equipment Innovation Alliance

China Integrated Circuit Components Innovation Alliance

China Integrated Circuit Testing and Validation Innovation Alliance

Guangdong Integrated Circuit Industry Association

Guangdong-Hong Kong-Macao Greater Bay Area Semiconductor Industry Alliance

II. Meeting Dates: April 17–19, 2023

3. Meeting Location: China-Singapore Knowledge City, Huangpu District, Guangzhou (Tengfen Garden, No. 2 Tengfei First Street)

4. Conference Hotel: Guangzhou Knowledge City Muwentie Hotel (No. 6 Junxian Street, Huangpu District, Guangzhou)

Schedule for the 2023 China Semiconductor Materials Innovation and Development Conference

2023 CHINA SEMICONDUCTOR MATERIALS INNOVATION AND DEVELOPMENT CONFERENCE

April 19, 2023 China Semiconductor Materials Innovation and Development Conference 2023 ICM China

Keynote Speech

Host: Shi Ying, Secretary-General of ICMtia

Host: Ying Shi, Secretary General, ICMtia

9:00-9:30 Trends in Chiplet Integration and Packaging

Trends of Chiplet Integrated Packages

Dr. Zheng Zi Qi, CTO of Advanced Packaging at Tongfu Microelectronics Co., Ltd.

Dr. Key. Chung, Advanced Package CTO, TongFu Microelectronics Co., Ltd

9:30–9:50 Opportunities and Challenges Posed by China’s Electric Vehicle Development for Domestic Power Semiconductors and Materials

China’s EV Car Boom—An Opportunity for Power Semiconductors

Dr. Wang Qingyu, General Manager and Director of Shanghai Xin'ao Technology Co., Ltd.

Dr. Jeffrey Wang, CEO and board member of Simgui Technology

9:50-10:10 Trends in Advanced Photoresist Development and Local Diversified Supply Planning

Development Trends of Advanced Photolithography Materials and Domestic Supply Chain Planning

Li Bing, General Manager of Beijing Kehua Microelectronics Materials Co., Ltd.

Benjamin Li, CEO of Kempur Microelectronics Inc.

10:10-10:30 Integrated Circuit Wet Cleaning Technology

Semiconductor Cleaning and Surface Preparation Technology

Speaker: Peng Hongxiu, Deputy General Manager of Anji Microelectronics Technology (Shanghai) Co., Ltd.

Hongxiu Peng, VP, Anji Microelectronics

10:30-10:50 This Copper Is Not That Copper—The Underlying Design and Implementation of Grain Structure

Not All Copper Is Created Equal – Grain Engineering in Electroplating

Speaker: Dr. Zhang Yun, Founder and General Manager of Suzhou Xinhao New Materials

Dr. Yun Zhang, Founder and CEO, Shinhao Materials LLC

10:50-11:10 Exploring Innovative Paths for China’s Integrated Circuit Materials Technology

Exploration of the Technological Innovation Path for IC Materials in China

Speaker: Dr. Yu Wenjie, Deputy Director of the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences / Chairman and General Manager of the Shanghai Institute of Integrated Circuit Materials

Dr. Wenjie Yu, Deputy Director, Shanghai Institute of Microsystems and Information Technology, Chinese Academy of Sciences; Chairman and CEO, Shanghai Institute of IC Materials

11:10–11:30 What’s Next? Trends in U.S. Wafer Fab Expansion and Outlook for the Materials Supply Chain

What’s Next? U.S. Fab Expansions and the Outlook for Materials Supply Chain

Dr. Karey Holland, Chief Strategist and Co-founder of TECHCET

Karey Holland, Ph.D., Chief Strategist and Co-Founder, TECHCET

11:30-11:50 Current Status, Development Opportunities, and Challenges of China’s Integrated Circuit Manufacturing Materials Industry

The status and development opportunities and challenges of China’s IC industry.

manufacturing materials industry.

Shi Ying, Executive Vice Chairman and Secretary-General of ICMtia

Ying Shi, Executive Vice Chairman & Secretary General, ICMtia

12:00-13:00 Buffet Lunch

14:00–17:00 ICMtia Emerging Supply-Demand Exchange Meeting (Closed Door)

ICMtia Emerging Supply-Demand Matchmaking Meeting (Closed-Door)

Closed-Door Meeting

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