The completion and commissioning of the second phase of Zhongke Kehua, along with the 10th-anniversary celebration of the first phase’s commissioning, were a complete success.

At 9:00 a.m. on September 16, the grand ceremony marking the completion and commissioning of Phase II of Zhongke Kehua, as well as the 10th anniversary of the commissioning of Phase I, was held with great pomp and circumstance. The ceremony brought together nearly 200 guests, including leaders from the China Semiconductor Industry Association, leaders from the Institute of Chemistry, Chinese Academy of Sciences, and representatives of various shareholders; leaders and heads of departments from the Hailing District Committee and Government, the Hailing Industrial Park, and the Dongcheng Group; leaders from upstream and downstream partners and from intermediary agencies providing guidance for the company’s IPO; and representatives from the contractor responsible for Phase II of the project.

First, Mr. Lu Xukui, Chairman of Zhongke Kehua, delivered a speech on behalf of the company. In his address, he reviewed the arduous journey that Zhongke Kehua has undertaken since its inception, highlighted the company’s significant achievements in recent years and the progress made on the second-phase project, and expressed a strong willingness to deepen cooperation with upstream and downstream partners. Finally, he stated that Zhongke Kehua is fully confident and determined to overcome the challenges facing its epoxy molding compound products and contribute to the revitalization of China’s semiconductor industry!

Subsequently, Mr. Yu Xiekang, Vice Chairman of the China Semiconductor Industry Association; Mr. Fan Qinghua, Secretary of the Party Committee of the Institute of Chemistry, Chinese Academy of Sciences; Mr. Liu Jianbo, District Mayor of Hailing District; Mr. Li Xiaodong, Chairman of Jiangsu Lianrui New Materials Co., Ltd.; and Mr. Wu Jianzhong, General Manager of the Packaging and Testing Business Group at HuaRun Microelectronics Co., Ltd., each delivered remarks in turn. From the perspectives of the industry, shareholders, government, suppliers, and customers, they expressed their congratulations on the completion and commissioning of the second phase of Zhongke Kehua’s project as well as the 10th anniversary of the commissioning of its first phase. They also pledged their full support for Zhongke Kehua’s future development and expressed strong confidence in its prospects!
Finally, with the joint witness of the attending guests, the launch ceremony marking the completion and commissioning of Phase II of the project brought the celebration to a climax.

After the meeting, the participating leaders and guests toured the company’s exhibition hall and the second-phase production workshop, and took a group photo to commemorate the occasion.

The second-phase construction of the Zhongke Kehua Epoxy Molding Compound Project broke ground in April 2022. Upon completion, the single-building facility for epoxy molding compounds will cover an area of 54,000 square meters. With the completion and commissioning of the second-phase project, Zhongke Kehua now has seven production lines for epoxy molding compounds, with an annual production capacity exceeding 15,000 tons. Once all subsequent production lines of the second-phase project are fully operational, the total production capacity for epoxy molding compounds will reach 30,000 tons. The newly built epoxy molding compound production lines were independently designed by Zhongke Kehua, and all production equipment has been domestically manufactured. Moreover, Zhongke Kehua has pioneered the development of a centralized control platform for epoxy molding compound production in China, enabling digital connectivity among production-line equipment and gradually introducing program-based control. The integration of robots, automated devices, and unmanned material distribution systems will significantly enhance operational stability and online inspection and monitoring capabilities, further ensuring consistent product quality.

On the day of the celebration, participating leaders and guests also jointly attended the “Surging Tide in Hailing: Smart Innovation in New Materials—2023 Hailing New Materials Industry Development Summit Forum,” hosted by the Hailing District Government. The conference was chaired by Ms. Shi Ying, Secretary-General of the Supporting Industries Branch of the China Semiconductor Industry Association and Executive Vice Chairman and Secretary-General of the Integrated Circuit Materials Industry Technology Innovation Alliance.

Mr. Sun Qian, Deputy District Mayor of Hailing District, first introduced the industrial development situation of Hailing District at the forum. Ms. Xu Dongmei, Secretary-General of the Packaging and Testing Branch of the China Semiconductor Industry Association, presented an overview of the current status and trends in the packaging and testing industry. Dr. Fu Dongsheng, Deputy Director of the Science and Technology Division at the Institute of Chemistry, Chinese Academy of Sciences, shared recent research advances in the field of new materials by the Institute of Chemistry, CAS. Ms. Tang Aiyun, General Manager of the Electronic Chemicals Division at Shandong Shengquan New Materials Co., Ltd., discussed the industrialization process of electronic chemicals within the Shengquan Group.

Finally, Mr. Wang Shanxue, Deputy General Manager of Zhongke Kehua, shared information on the technological advancements and industrial upgrading of Zhongke Kehua’s epoxy molding compound products.

Currently, Zhongke Kehua has established dual R&D centers in Beijing and Taizhou, assembling an R&D team of more than 30 members, predominantly composed of PhDs and master’s degree holders. Among them, eight team members have over 10 years of experience working with epoxy molding compounds. The company has built a comprehensive R&D platform focusing on material analysis and performance testing, packaging and reliability evaluation, and failure analysis. Additionally, it has jointly established a Joint Laboratory for Electronic Packaging Materials with the Institute of Chemistry, Chinese Academy of Sciences. The company holds over 20 invention patents and utility model patents. Its flagship product—epoxy molding compounds—has made significant progress; the sales proportion of the KHG500 series (MSL3-rated) has exceeded 50%. The KHG400 product meets industrial-grade usage requirements. Epoxy molding compounds for QFP, QFN, and DFN packages, as well as high-Tg epoxy molding compounds, have all entered mass production. These products have been adopted by leading domestic and international packaging and testing companies such as Huatian Technology, Tongfu Microelectronics, Changdian Technology, HuaRun Microelectronics, and Riyue Xin Group. Moreover, FOPLP, FCCSP, and automotive-grade MSL1 products have successfully passed the rigorous evaluations conducted by renowned customers. Zhongke Kehua has completed key technological breakthroughs and prepared its entire product line for epoxy molding compounds. Moving forward, the company will closely collaborate with industry clients to steadily advance the localization and substitution of epoxy molding compounds.

The attendees remarked that this forum was precise and pragmatic, packed with valuable information, and provided an excellent opportunity to stay abreast of the latest industry trends and product technologies.

Safeguard China’s chip industry and jointly build the Chinese Dream! The series of celebratory events was a complete success!