The 2023 China Semiconductor Materials Innovation and Development Conference was successfully held in Guangzhou.

2023 marks the year when China’s innovation-driven development in science and technology deepens and the “specialized, refined, distinctive, and innovative” ethos is further promoted. The Chinese integrated circuit industry will achieve new accomplishments as it embarks on a new journey toward the second centenary goal of building a modern socialist country in all respects. At this historic juncture, the Integrated Circuit Materials Innovation Alliance (hereinafter referred to as the “Materials Alliance”), together with the Semiconductor Supporting Industries Branch of the China Semiconductor Industry Association, continues to collaborate with the Integrated Circuit Branch of the China Semiconductor Industry Association, the Integrated Circuit Equipment Innovation Alliance, the Integrated Circuit Components Innovation Alliance, the Integrated Circuit Packaging and Testing Innovation Alliance, and the China Integrated Circuit Testing and Inspection Innovation Alliance. Under the theme “Standing at a New Stage of Development and Building a New Development Pattern for Chips,” they jointly hosted the “25th China Integrated Circuit Manufacturing Annual Conference & Supply Chain Innovation Development Conference” from April 17 to 19 in Guangzhou. During this event, the Materials Alliance, together with the Semiconductor Supporting Industries Branch of the China Semiconductor Industry Association, also held the “2023 China Semiconductor Materials Innovation and Development Conference.”

The scene of the 2023 China Semiconductor Materials Innovation and Development Conference

On the morning of April 19, Shi Ying, Secretary-General of the Materials Alliance, chaired the High-Level Forum of the 2023 China Semiconductor Materials Innovation and Development Conference. More than 280 representatives from manufacturing and packaging/testing companies, as well as directors and member companies of the Materials Alliance, attended the meeting.

This conference specially invited renowned industry experts to deliver insightful presentations, including Dr. Zheng Zi Qi, CTO of Advanced Packaging at Tongfu Microelectronics Co., Ltd.; Dr. Wang Qingyu, General Manager of Shanghai Xin'ao Technology Co., Ltd.; Li Bing, General Manager of Beijing Kehua Microelectronic Materials Co., Ltd.; Peng Hongxiu, Deputy General Manager of Anji Microelectronics Technology (Shanghai) Co., Ltd.; Dr. Zhang Yun, General Manager of Suzhou Xinhao New Materials Technology Co., Ltd.; Ms. Feng Li, Deputy General Manager of the Shanghai Institute of Integrated Circuit Materials; Dr. Karey Holland, Chief Strategist and Co-founder of TECHCET.LLC; and Shi Ying, Secretary-General of the Materials Alliance. These experts covered a wide range of topics—from international to domestic perspectives, from cutting-edge technologies to innovative pathways, from the packaging and testing sector to various segments of materials, and from market trends to industrial breakthroughs—offering a comprehensive exploration of the development of the materials industry.

Dr. Zheng Zi Qi, CTO of Advanced Packaging at Tongfu Microelectronics Co., Ltd., delivered a presentation titled “Trends in Chiplet Integration Packaging.” In his presentation, Dr. Zheng introduced the application scope, technical features, and market advancement of chiplet integration packaging. He pointed out that currently, signals in chiplet-integrated designs are all custom-made, requiring large-sized packages and high-density interconnections. As a result, this approach suffers from drawbacks such as high costs, significant internal stresses, extremely high I/O densities, and long development cycles. The technological breakthroughs in this field face numerous challenges. Finally, Dr. Zheng summarized the current state of chiplet integration development in China as well as future technology trends.

In his report titled “Opportunities and Challenges Posed by China’s Electric Vehicle Development for Domestic Power Semiconductors and Materials,” Dr. Wang Qingyu, General Manager of Shanghai Xin’ao Technology Co., Ltd., pointed out that the global automotive industry is moving toward electrification and intelligentization. Eighty percent of automotive innovations originate from the chip and electronics industries, with chips serving as the core component supporting both the electrification and intelligentization of vehicles. The development of new-energy vehicles in China presents excellent growth opportunities for the domestic chip and power semiconductor industries.

In his report titled “Trends in Photoresist Development and Local Diversified Supply Planning,” Li Bing, General Manager of Beijing Kehua Microelectronics Materials Co., Ltd., introduced the evolution of lithography technology in advanced integrated circuit manufacturing processes. He outlined the technical requirements for various types of photoresists—including I-line, KrF, ArF, and EUV—and highlighted the material challenges associated with these technologies. By analyzing the current status of technological nodes in chip manufacturing on the Chinese mainland as well as future development prospects, he examined the corresponding market demands for different types of photoresists. Furthermore, taking into account the diverse photoresist markets and supply conditions, along with the stringent verification requirements imposed by advanced IC manufacturing processes, he discussed both the opportunities and challenges facing China’s photoresist industry. From both the perspectives of customers and suppliers, he explored strategies for planning diversified local supply chains for photoresists and their raw materials, aiming to achieve self-sufficient and secure supply.

In his presentation titled “Wet Cleaning Technology for Integrated Circuits,” Peng Hongxiu, Deputy General Manager of Anji Microelectronics Technology (Shanghai) Co., Ltd., pointed out that as advanced process nodes continue to shrink in size, wet cleaning is facing increasingly greater challenges, including the control of small-size defects, cleaning and drying of High Aspect Ratio (HAR) structures, compatibility with new materials, safety and environmental considerations, and ultra-high-purity quality requirements. In line with these wet cleaning technology demands, single-wafer清洗 machines are gradually replacing batch槽式清洗 machines to reduce defect rates, while supercritical carbon dioxide is being progressively introduced to prevent the collapse of HAR structures. From the perspective of safety and environmental protection, performance enhancement, and advantages in equipment and materials, post-etch cleaning solutions are gradually transitioning from solvent-based formulations to semi-aqueous and aqueous systems.

Dr. Zhang Yun, General Manager of Suzhou Xinhao New Materials Technology Co., Ltd., delivered a presentation titled “This Copper Is Not That Copper—The Underlying Design and Implementation of Grain Structure.” She pointed out that advanced packaging is experiencing rapid growth, which in turn is creating numerous opportunities for innovation. The specific requirements of heterogeneous integration are posing new challenges to both materials and processes. Using three different copper processes as examples, she discussed the requirements for copper-to-copper bonding, identified which process is best suited for these requirements, and explained how customers can achieve low-temperature bonding while ensuring that other requirements are met.

Feng Li, Deputy General Manager of the Shanghai Institute of Integrated Circuit Materials, delivered a report titled “Exploring Innovation Paths for China’s Integrated Circuit Materials Technology.” She noted that as the integrated circuit industry continues to deepen and develop, the advancement of the materials industry and the upgrading of its innovation pathways have become increasingly critical. She pointed out that new devices and new processes are driving innovation in new materials and new equipment, while advanced materials are facilitating the development of semiconductor devices toward more sophisticated manufacturing processes. The report also analyzed the current status and challenges facing innovation in China’s integrated circuit materials technology, and proposed new directions for future technological innovation.

Dr. Karey Holland, Chief Strategist and Co-founder of TECHCET.LLC, pointed out that, amid the global trend of expanding chip investments, the global materials submarket is undergoing significant changes. In her report, “U.S. Wafer Fab Expansion Trends and Materials Supply Chain Outlook,” she highlighted how shifting international dynamics and increasing downward pressure in global markets are creating both opportunities and challenges for materials suppliers seeking to expand their businesses in light of these new trends.

In the report titled “Current Status, Development Opportunities, and Challenges of China’s Integrated Circuit Manufacturing Materials Industry,” Shi Ying, Secretary-General of the Materials Alliance, analyzed the maturity levels of key products in specialized fields including silicon materials, lithography materials, specialty electronic gases, process chemicals, CMP polishing materials, sputtering targets, and packaging materials. The report also discussed the opportunities and challenges facing the domestic industry under the new circumstances.

That afternoon, the Materials Alliance concurrently held an emerging supply-demand matchmaking event and a networking session. Five domestic power device and advanced packaging companies and 40 domestic material suppliers engaged in focused or one-on-one closed-door exchanges, providing a platform and strong support for enhancing China’s local supply chain for emerging semiconductor manufacturing.

The scene from the 2023 ICMtia Emerging Supply and Demand Exchange Meeting

The scene of the 2023 Emerging Supply-Demand Matchmaking Conference